Electronic device and method for detecting temperature thereof

Abstract

The disclosure provides an electronic device and a method for detecting temperature thereof. The method is adapted to the electronic device including a plurality of temperature sensors and includes the following steps. An operating status of the electronic device is determined. A plurality of selected temperature sensors are selected from the temperature sensors according to the operating status of the electronic device. A plurality of reference temperatures sensed by the selected temperature sensors are obtained. A surface temperature of the electronic device is determined based on the reference temperatures.

Description

[Technical Field]

[0001] This disclosure relates to an electronic device and a method for detecting temperature thereon. [Previous Technology]

[0002] With the advancement of technology, consumer electronic devices have become ubiquitous in modern people's daily lives. The electronic components inside these devices consume electrical energy during operation, and a portion of this energy is converted into heat. Heat generation is particularly significant when processors, graphics processing units (GPUs), or other high-energy-consuming components are operating. Therefore, these consumer electronic devices generate heat during use, causing the surface temperature of the device to rise. It is known that users experience discomfort when their skin touches the hot surface of the device, and prolonged contact can even lead to low-temperature burns. Therefore, real-time monitoring of the surface temperature of electronic devices is necessary. Currently, most methods estimate the surface temperature of electronic devices using a single temperature sensor and fixed calculation methods. However, this method of temperature estimation is not accurate. [Summary of the Invention]

[0003] This disclosure provides a temperature detection method applicable to an electronic device including multiple temperature sensors, and includes the following steps: determining the operating state of the electronic device; selecting multiple selected temperature sensors from the multiple temperature sensors based on the operating state of the electronic device; acquiring multiple reference temperatures sensed by the multiple selected temperature sensors; and determining the surface temperature of the electronic device based on the multiple reference temperatures.

[0004] This disclosure also provides an electronic device including a plurality of temperature sensors and a processor. The processor is coupled to the plurality of temperature sensors and configured to perform the following steps: determining an operating state of the electronic device; selecting a plurality of selected temperature sensors from the plurality of temperature sensors based on the operating state of the electronic device; acquiring a plurality of reference temperatures sensed by the plurality of selected temperature sensors; and determining a surface temperature of the electronic device based on the plurality of reference temperatures.

[0005] Based on the above, in this embodiment of the invention, some selected temperature sensors can be selected from a plurality of temperature sensors disposed at different locations according to the operating state of the electronic device. Furthermore, based on the reference temperatures sensed by these selected temperature sensors, the surface temperature of the electronic device can be accurately estimated. Therefore, the estimation of the surface temperature can be more accurate, which is beneficial for maintaining the performance stability of the device and the safety of the user.

Implementation Method

[0006] Some embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Component symbols used in the following description are considered the same or similar components when they appear in different drawings. These embodiments are only a part of the present invention and do not disclose all possible implementations of the invention. More precisely, these embodiments are merely examples of the apparatus and methods within the scope of the present invention's patent application.

[0007] Please refer to Figure 1, which is a schematic diagram of an electronic device according to one embodiment of the present invention. The electronic device 100 may be, for example, a mobile phone, a game console, a tablet computer, a laptop computer, a smart wearable device, a server device, or a projector, etc., and this disclosure is not limited thereto. The electronic device 100 may include a plurality of temperature sensors 110_1 to 110_N, a human-machine interface device 120, a storage device 130, and a processor 140.

[0008] A plurality of temperature sensors 110_1 to 110_N are disposed inside the electronic device 100 for sensing temperature. This disclosure does not limit the number of temperature sensors 110_1 to 110_N, which can be determined depending on the actual application. These temperature sensors 110_1 to 110_N may include a plurality of thermistors disposed on at least one circuit board. The aforementioned thermistors may be thermistors, thermocouples, or other thermistors used for sensing temperature, and this disclosure is not limited thereto. The temperature sensors 110_1 to 110_N may be distributed in different areas within the electronic device 100. In different embodiments, the temperature sensors 110_1 to 110_N may be disposed on multiple circuit boards. In different embodiments, the temperature sensors 110_1 to 110_N may be disposed on different surfaces of the same circuit board.

[0009] Please refer to FIG2, which is a schematic diagram illustrating a plurality of temperature sensors according to an embodiment of the present invention. An example will be described using an electronic device 100 having three temperature sensors 110_1 to 110_3. Temperature sensor 110_1 may be disposed on the main circuit board P1 of the electronic device 100 and located relatively close to the processor 140. From another viewpoint, temperature sensor 110_1 is disposed in a hot zone within the electronic device 100. More specifically, the hot zone within the electronic device 100 is the area near the processor 140, because the processor 140, which performs complex computational tasks, is the main heat source of the electronic device 100.

[0010] On the other hand, temperature sensors 110_2 and 110_3 may be disposed in the electronic device 100 at a location away from the processor 140. In the example of FIG. 2, temperature sensor 110_2 is disposed at the top of the electronic device 100, while temperature sensor 110_3 is disposed at the bottom of the electronic device 100. From another viewpoint, because temperature sensors 110_2 and 110_3 are far from the main heat source of the electronic device 100 (i.e., the processor 140), temperature sensors 110_2 and 110_3 are located in a cold area within the electronic device 100.

[0011] Taking a mobile phone as an example, the temperature sensor 110_2 can be located near the camera module 150. The camera module 150 may include an image sensor and a lens. The temperature sensor 110_3 can be located near the charging module 160, which includes a charging circuit and a charging port, and is located on a circuit board P2 that is different from the main circuit board P1. In this case, the temperature sensed by the temperature sensors 110_2 and 110_3 is less affected by the processor 140. It should be noted that the temperature sensed by the temperature sensor 110_2 is significantly related to whether the camera module 150 is operating, and the temperature sensed by the temperature sensor 110_3 is significantly related to whether the electronic device 100 is charging.

[0012] In this embodiment, the plurality of temperature sensors 110_1 to 110_N may include a primary temperature sensor disposed in a hot zone within the electronic device 100 and secondary temperature sensors disposed in a cold zone within the electronic device 100. Taking FIG2 as an example, temperature sensor 110_1 is a primary temperature sensor located in the hot zone, while temperature sensors 110_2 and 110_3 are secondary temperature sensors located in the cold zone.

[0013] The human-machine interface device 120 may include one or more output devices, such as a display, speaker, or indicator light. Users of the electronic device 100 can interact with the electronic device 100 through the human-machine interface device 120. In some embodiments, the processor 140 may provide temperature information about the surface temperature to the user through the output devices of the human-machine interface device 120.

[0014] The storage device 130 can be used to store data and software modules, etc., and can be, for example, any type of fixed or removable random access memory (RAM), read-only memory (ROM), flash memory or other similar devices, integrated circuits and combinations thereof.

[0015] The processor 140 is coupled to temperature sensors 110_1 to 110_N, human-machine interface device 120, and storage device 130, and is, for example, a general-purpose processor, a special-purpose processor, a conventional processor, a digital signal processor, a microprocessor, one or more microprocessors incorporating a digital signal processor core, a controller, a microcontroller, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), any other type of integrated circuit, state machine, or other similar device.

[0016] The processor 140 can access and execute the software modules recorded in the storage device 130 to implement the temperature detection method in this embodiment of the invention. The aforementioned software modules can be broadly interpreted as instructions, instruction sets, code, program code, program, software suite, thread, program, function, etc., regardless of whether they are called software, firmware, middleware, microcode, hardware description language, or others.

[0017] Figure 3 is a flowchart illustrating a temperature detection method according to an embodiment of the present invention. Referring to Figures 1 and 3, the method of this embodiment is applicable to the electronic device 100 in the above embodiments. The detailed steps of the temperature detection method of this embodiment are described below with reference to the various components in the electronic device 100.

[0018] In step S310, the processor 140 determines the operating state of the electronic device 100. In step S320, the processor 140 selects a plurality of selected temperature sensors from a plurality of temperature sensors 110_1 to 110_N according to the operating state of the electronic device 100. The selected temperature sensors may be some or all of the plurality of temperature sensors 110_1 to 110_N. Specifically, according to the operating state of the electronic device 100, the processor 140 may select selected temperature sensors from the plurality of temperature sensors 110_1 to 110_N that are suitable for participating in the estimation of surface temperature.

[0019] In some embodiments, the operating state of the electronic device 100 may include the hardware operating state of the electronic device 100.

[0020] In some embodiments, the operating state of the electronic device 100 includes whether a heat source element near the temperature sensor is operating, that is, whether the heat source element is performing a specific function. The aforementioned heat source element may include the processor 140, camera module 150, charging module 160, wireless communication chip, battery 170, or other electronic components that generate heat. For example, the operating state of the electronic device 100 may include whether the camera module 150 is performing a photographing function. The operating state of the electronic device 100 may include whether the charging module 160 is performing a charging function. The operating state of the electronic device 100 may include whether the wireless communication chip is performing a data transmission and reception function.

[0021] In some embodiments, the operating state of the electronic device 100 includes the operating state of a heat source element near the temperature sensor. For example, the operating state of the electronic device 100 may include the charging current of the charging module 160. Alternatively, the operating state of the electronic device 100 may include the activation duration of the camera module 150. Or, the operating state of the electronic device 100 may include the load state of the processor 140.

[0022] In some embodiments, the operating state of the electronic device 100 may include the software operating state of the electronic device 100. In some embodiments, the operating state of the electronic device 100 may include the type of application being executed on the electronic device 100. For example, the processor 140 may decide whether to select a temperature sensor located near the camera module based on whether a camera application is being executed.

[0023] In step S330, the processor 140 acquires multiple reference temperatures sensed by multiple selected temperature sensors. In step S340, the processor 140 determines the surface temperature of the electronic device 100 based on the multiple reference temperatures. That is, after selecting multiple selected temperature sensors based on the hardware and / or software operating states of the electronic device 100, the processor 140 can estimate the surface temperature of the electronic device 100 based on the reference temperatures measured by these selected temperature sensors respectively. In other words, depending on the different operating states of the electronic device 100, the processor 140 can use different combinations of reference temperatures from multiple temperature sensors to determine the surface temperature of the electronic device 100, rather than determining the surface temperature through a fixed calculation method. As mentioned above, since temperature sensors unsuitable for estimating surface temperature have been excluded, the accuracy of surface temperature estimation can be effectively improved.

[0024] In some embodiments, the processor 140 can perform a function based on the surface temperature of the electronic device 100. More specifically, in some embodiments, the processor 140 can control the display in the human-machine interface device 120 to display the surface temperature of the electronic device 100 so that the user can be aware of the surface temperature of the electronic device 100. Alternatively, in some embodiments, the processor 140 can provide a warning through the human-machine interface device 120 based on the surface temperature of the electronic device 100 to prevent the user from suffering low-temperature burns. Alternatively, in some embodiments, the processor 140 can perform a thermal protection operation based on the surface temperature of the electronic device 100 to prevent hardware damage to the electronic device 100 due to overheating and to ensure safe use.

[0025] In some embodiments, the processor 140 may estimate the surface temperature of the electronic device 100 based on these reference temperatures through function calculation or table lookup. In some embodiments, the processor 140 may estimate the surface temperature of the electronic device 100 by performing a weighted summation operation on these reference temperatures.

[0026] In some embodiments, the plurality of temperature sensors 110_1 to 110_N include a primary temperature sensor and at least one secondary temperature sensor. The primary temperature sensor is disposed in a hot zone within the electronic device 100, and the at least one secondary temperature sensor is disposed in at least one cold zone within the electronic device 100. The selected temperature sensor includes at least one of the primary temperature sensor and the at least one secondary temperature sensor. That is, the processor 140 can determine the surface temperature of the electronic device 100 based on a reference temperature sensed by the primary temperature sensor in the hot zone and a reference temperature sensed by the at least one secondary temperature sensor in the cold zone. By simultaneously considering the sensed temperatures in the hot and cold zones, the accuracy of estimating the surface temperature of the electronic device 100 can be effectively improved.

[0027] Please refer to FIG4, which is a schematic diagram illustrating multiple reference temperatures and surface temperatures according to an embodiment of the present invention. The reference temperature sensed by the primary temperature sensor located in the hot zone is shown in temperature rise curve 401. The reference temperature sensed by the secondary temperature sensor located in the cold zone is shown in temperature rise curve 402. By performing a weighted summation operation on the reference temperatures sensed by the primary temperature sensor and the secondary temperature sensor, the processor 140 can estimate the surface temperature of the electronic device 100 as shown in temperature rise curve 403. The sum of the multiple weighting coefficients used in the weighted summation operation is 1, but the actual values ​​of these weighting coefficients can be determined through experiments and tests, and this disclosure is not limited thereto.

[0028] Figure 5 is a flowchart illustrating a temperature detection method according to an embodiment of the present invention. Referring to Figures 1 and 5, the method of this embodiment is applicable to the electronic device 100 in the above embodiments. The detailed steps of the temperature detection method of this embodiment are described below with reference to the various components in the electronic device 100.

[0029] In step S510, the processor 140 determines the operating state of the electronic device 100. In this embodiment, step S510 can be implemented as steps S511 to S512.

[0030] In this embodiment, the plurality of temperature sensors 110_1 to 110_N include a main temperature sensor and at least one secondary temperature sensor. The main temperature sensor is disposed in a hot zone within the electronic device 100, and the at least one secondary temperature sensor is disposed in at least one cold zone within the electronic device 100.

[0031] In step S511, the processor 140 identifies a heat source element located near at least one primary temperature sensor. In step S512, the processor 140 determines whether the heat source element located near the primary temperature sensor is operational. Specifically, although the secondary temperature sensor is located in a cold area within the electronic device 100, the heat source element near the secondary temperature sensor can affect the reference temperature sensed by the secondary temperature sensor. Therefore, the processor 140 determines whether the secondary temperature sensor participates in the estimation of surface temperature based on whether the heat source element near the secondary temperature sensor is operational.

[0032] In step S520, the processor 140 selects a plurality of selected temperature sensors from the plurality of temperature sensors 110_1 to 110_N according to the operating state of the electronic device 100. In this embodiment, step S520 can be implemented as steps S521 to S523.

[0033] In step S521, when the heat source element located near the at least one primary temperature sensor is not operating (determined as no in step S512), the processor 140 selects the at least one primary temperature sensor as one of a plurality of selected temperature sensors. In step S522, when the heat source element located near the at least one primary temperature sensor is operating (determined as yes in step S512), the processor 140 discards the at least one primary temperature sensor as one of a plurality of selected temperature sensors.

[0034] In other words, when the reference temperature sensed by a primary temperature sensor increases due to the heating of a nearby heat source element, the processor 140 may not select that secondary temperature sensor to participate in the estimation of the surface temperature. Conversely, when the reference temperature sensed by a primary temperature sensor is not increased by a nearby heat source element, the processor 140 may select that secondary temperature sensor to participate in the estimation of the surface temperature.

[0035] Taking Figure 2 as an example, the reference temperature sensed by temperature sensor 110_2, which is a secondary temperature sensor, is significantly affected by whether the nearby camera module 150 is operating. When the camera module 150 is operating, the reference temperature sensed by temperature sensor 110_2 is significantly increased due to the heat emitted by the camera module 150. Therefore, when the camera module 150 is operating, the processor 140 may not select temperature sensor 110_2 and may not determine the surface temperature based on the reference temperature of temperature sensor 110_2. Alternatively, the reference temperature sensed by temperature sensor 110_3, which is a secondary temperature sensor, is significantly affected by whether the nearby charging module 160 is charging. When the charging module 160 is charging, the reference temperature sensed by temperature sensor 110_3 is significantly increased due to the heat emitted by the charging module 160. Therefore, when the charging module 160 is charging, the processor 140 may not select the temperature sensor 110_3 and may not determine the surface temperature based on the reference temperature of the temperature sensor 110_3.

[0036] In step S523, the processor 140 selects a primary temperature sensor as one of a plurality of selected temperature sensors. As described above, the processor 140 may select one or more primary temperature sensors within the hot zone to participate in the estimation of the surface temperature. Taking FIG2 as an example, the processor 140 may select temperature sensor 110_1 disposed on the main circuit board P1 and located near the processor 140 as the primary temperature sensor.

[0037] In step S530, the processor 140 acquires multiple reference temperatures sensed by multiple selected temperature sensors. In step S540, the processor 140 determines the surface temperature of the electronic device 100 based on the multiple reference temperatures. In this embodiment, step S540 can be implemented as steps S541 to S542.

[0038] In step S541, the processor 140 determines the weighting coefficient corresponding to each reference temperature according to the operating state of the electronic device 100. In step S542, the processor 140 calculates the weighted sum of the multiple reference temperatures corresponding to the multiple selected temperature sensors to determine the surface temperature of the electronic device 100.

[0039] In detail, after determining whether each temperature sensor 110_1 to 110_N participates in the estimation of surface temperature, the processor 140 can acquire multiple selected temperature sensors. It is understood that the selected temperature sensors can change according to changes in the operating state of the electronic device 100. In this case, the processor 140 can determine the surface temperature of the electronic device 100 according to different weighted summation formulas. Different weighted summation formulas have different numbers of weighting items and weighting coefficients.

[0040] In some embodiments, the processor 140 may determine the weighting coefficients corresponding to each selected temperature sensor by looking up a table. In some embodiments, the weighting coefficients corresponding to each selected temperature sensor may be fixed preset values.

[0041] Taking Figure 2 as an example, when the camera module 150 is not operating and the charging module 160 is charging, the processor 140 can determine the surface temperature of the electronic device 100 based on the reference temperature sensed by the temperature sensor 110_1 and the reference temperature sensed by the temperature sensor 110_2. For example, the processor 140 can determine the surface temperature of the electronic device 100 according to the following formula (1). ST=w1*RT1+w2*RT2 Formula (1) Wherein, ST represents the surface temperature of the electronic device 100; RT1 represents the reference temperature sensed by the temperature sensor 110_1; RT2 represents the reference temperature sensed by the temperature sensor 110_3; w1 represents the weighting coefficient corresponding to the temperature sensor 110_1; w2 represents the weighting coefficient corresponding to the temperature sensor 110_2.

[0042] In another scenario, when the camera module 150 is operating and the charging module 160 is not charging, the processor 140 can determine the surface temperature of the electronic device 100 based on the reference temperature sensed by the temperature sensor 110_1 and the reference temperature sensed by the temperature sensor 110_3. For example, the processor 140 can determine the surface temperature of the electronic device 100 according to the following formula (2). ST=w3*RT1+w4*RT3 Formula (2) Wherein, ST represents the surface temperature of the electronic device 100; RT1 represents the reference temperature sensed by the temperature sensor 110_1; RT3 represents the reference temperature sensed by the temperature sensor 110_3; w3 represents the weighting coefficient corresponding to the temperature sensor 110_1; w4 represents the weighting coefficient corresponding to the temperature sensor 110_3.

[0043] It should be noted that in some embodiments, the weighting coefficient w3 may be the same as the weighting coefficient w1, and the weighting coefficient w2 may be the same as the weighting coefficient w4. In other embodiments, the weighting coefficient w3 may be different from the weighting coefficient w1, and the weighting coefficient w2 may be different from the weighting coefficient w4. That is, the weighting coefficients may vary depending on the combination of selected temperature sensors.

[0044] In another scenario, when the camera module 150 is not operating and the charging module 160 is not charging, the processor 140 can determine the surface temperature of the electronic device 100 based on the reference temperatures sensed by the temperature sensors 110_1 to 110_3. For example, the processor 140 can determine the surface temperature of the electronic device 100 according to the following formula (3). ST=w5*RT1+w6*RT2+w7*RT3 Formula (3) Wherein, ST represents the surface temperature of the electronic device 100; RT1 represents the reference temperature sensed by the temperature sensor 110_1; RT3 represents the reference temperature sensed by the temperature sensor 110_3; w5 represents the weighting coefficient corresponding to the temperature sensor 110_1; w6 represents the weighting coefficient corresponding to the temperature sensor 110_2; and w4 represents the weighting coefficient corresponding to the temperature sensor 110_3.

[0045] Figure 6 is a flowchart illustrating a temperature detection method according to an embodiment of the present invention. Referring to Figures 1 and 6, the method of this embodiment is applicable to the electronic device 100 in the above embodiments. The detailed steps of the temperature detection method of this embodiment are described below with reference to the various components in the electronic device 100.

[0046] In step S610, the processor 140 determines the operating state of the electronic device 100. In step S620, the processor 140 selects a plurality of selected temperature sensors from a plurality of temperature sensors 110_1 to 110_N according to the operating state of the electronic device 100. In step S630, the processor 140 acquires a plurality of reference temperatures sensed by the plurality of selected temperature sensors. In step S640, the processor 140 determines the surface temperature of the electronic device 100 based on the plurality of reference temperatures. The implementation details of steps S610 to S640 can be found in the description of the foregoing embodiments and will not be repeated here.

[0047] In step S650, the processor 140 detects a system power consumption of the electronic device 100. In step S660, the processor 140 determines the ambient temperature of the environment in which the electronic device 100 is located based on the surface temperature, system power consumption, and temperature rise coefficient. For example, the processor 140 may determine the ambient temperature of the environment in which the electronic device 100 is located according to the following formula (4). The temperature rise coefficient can be determined through experiments and tests, and this disclosure is not limited thereto. Ambient temperature = Surface temperature - (Temperature rise coefficient * System power consumption) Formula (4)

[0048] In detail, the processor 140 can obtain the system power consumption (in watts) of the electronic device 100 by estimating, requesting power from the power management chip, or monitoring the battery's discharge state through software. Then, the processor 140 can calculate the ambient temperature of the environment in which the electronic device 100 is located based on the system power consumption and the surface temperature. Furthermore, when the surface temperature is high but the system power consumption is not high, the processor 140 can infer that the electronic device 100 is in a high-temperature environment. Therefore, the processor 140 can notify the user through the human-machine interface device 120 to move the electronic device 100 to a lower-temperature environment to prevent the temperature of the electronic device 100 from continuing to rise and causing damage.

[0049] In summary, in this embodiment of the invention, some selected temperature sensors can be chosen from a plurality of temperature sensors located at different positions according to the operating state of the electronic device. Furthermore, based on the reference temperatures sensed by these selected temperature sensors, the surface temperature of the electronic device can be accurately estimated. Therefore, since the surface temperature estimation is more accurate, a temperature protection mechanism can be implemented in a timely manner to alert the user. This further ensures the stability of the electronic device's performance and its lifespan, while simultaneously enhancing user safety.

[0050] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0051] FIG1 is a block diagram of an electronic device according to an embodiment of the present invention. FIG2 is a schematic diagram of a plurality of temperature sensors according to an embodiment of the present invention. FIG3 is a flowchart of a temperature detection method according to an embodiment of the present invention. FIG4 is a schematic diagram of a plurality of reference temperatures and surface temperatures according to an embodiment of the present invention. FIG5 is a flowchart of a temperature detection method according to an embodiment of the present invention. FIG6 is a flowchart of a temperature detection method according to an embodiment of the present invention.

Claims

1. A temperature detection method, applicable to an electronic device including multiple temperature sensors, comprising: Determines the operating state of the electronic device; Based on the operating state of the electronic device, a plurality of selected temperature sensors are selected from the plurality of temperature sensors; Acquire multiple reference temperatures sensed by the multiple selected temperature sensors; and determine the surface temperature of the electronic device based on the multiple reference temperatures.

2. The temperature detection method as claimed in claim 1, wherein the plurality of temperature sensors include a plurality of thermistors disposed on at least one circuit board.

3. The temperature detection method as claimed in claim 1, wherein the plurality of temperature sensors includes a primary temperature sensor and at least one secondary temperature sensor, the primary temperature sensor being disposed in a hot zone within the electronic device, and the at least one secondary temperature sensor being disposed in at least one cold zone within the electronic device.

4. The temperature detection method as claimed in claim 3, wherein the selected temperature sensor includes at least one of the primary temperature sensor and the at least one secondary temperature sensor.

5. The temperature detection method as described in claim 3, wherein the step of determining the operating state of the electronic device includes: Determine whether a heat source element located near the at least one temperature sensor is operational.

6. The temperature detection method as claimed in claim 5, wherein the step of selecting the plurality of selected temperature sensors from the plurality of temperature sensors according to the operating state of the electronic device includes: When the heat source element located near the at least one primary temperature sensor is not in operation, the at least one primary temperature sensor is selected as one of the plurality of selected temperature sensors; and when the heat source element located near the at least one primary temperature sensor is in operation, the at least one primary temperature sensor is discarded as one of the plurality of selected temperature sensors.

7. The temperature detection method as claimed in claim 1, wherein the step of determining the surface temperature of the electronic device based on the plurality of reference temperatures includes: The weighted sum of the multiple reference temperatures corresponding to the multiple selected temperature sensors is calculated to determine the surface temperature of the electronic device.

8. The temperature detection method as claimed in claim 7, wherein the step of determining the surface temperature of the electronic device based on the plurality of reference temperatures further comprises: The weighting coefficients corresponding to each of the plurality of reference temperatures are determined based on the operating state of the electronic device.

9. The temperature detection method as described in claim 1, further comprising: Detecting the system power consumption of the electronic device; And based on the surface temperature, the system power consumption, and a temperature rise coefficient, the ambient temperature of the environment in which the electronic device is located is determined.

10. An electronic device comprising: Multiple temperature sensors; A processor, coupled to the plurality of temperature sensors, and configured to: determine the operating state of the electronic device; Based on the operating state of the electronic device, a plurality of selected temperature sensors are selected from the plurality of temperature sensors; a plurality of reference temperatures sensed by the plurality of selected temperature sensors are obtained; and the surface temperature of the electronic device is determined based on the plurality of reference temperatures.

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