Physical vapor deposition process modeling

TW202630252APending Publication Date: 2026-07-16APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2025-10-21
Publication Date
2026-07-16

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Abstract

A method includes providing simulation inputs including chamber configuration parameters, process recipe parameters, and substrate geometry parameters to a physical vapor deposition (PVD) model. The method further includes obtaining output from the PVD model, including predicted properties of a substrate processed in accordance with the simulation inputs. The method further includes providing an alert to a user including the predicted properties.
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