Antenna wiring board
TW202630698APending Publication Date: 2026-07-16NITTO DENKO CORP
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Patent Information
- Application Number
- TW114147499
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-27
- Filing Date
- 2025-12-04
- Publication Date
- 2026-07-16
Abstract
The antenna wiring substrate includes a base layer, an antenna layer, and a ground layer. The base layer is transparent. The antenna layer is formed on one side of the base layer. The ground layer is formed on the other side of the base layer. One of the antenna layer and the ground layer is formed by a mesh member, which is constructed of conductive wire with a linewidth of 10.0µm or less and has openings. The other of the antenna layer and the ground layer is formed by a transparent conductive film.
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