Double-sided copper foil circuit board structure and manufacturing method thereof

Abstract

A method for manufacturing a circuit board structure with double-sided copper foil includes: providing a printed circuit board with its upper and lower surfaces covered by a surface copper layer; forming a protective layer on the surface copper layer; drilling to form a first through-hole, wherein a first inner sidewall of the printed circuit board is exposed through the first through-hole; forming a first copper foil layer on the first inner sidewall; removing a portion of the first copper foil layer and the protective layer, such that the first surface of the exposed first copper foil layer is flush with the second surface of the exposed surface copper layer; drilling to form a second through-hole, wherein a second inner sidewall of the printed circuit board is exposed through the second through-hole; and forming a second copper foil layer on the second inner sidewall of the printed circuit board and the surface copper layer, wherein the copper plating thickness above the upper surface of the printed circuit board is the same as the copper plating thickness above the lower surface.

Images