Expansion card assembly and electronic device

Abstract

An expansion card assembly is configured to be disposed in a chassis, and includes a plurality of expansion cards, an air guide structure and an external fan. The expansion cards are configured to be disposed in the chassis, and arranged side by side. An airflow channel is formed between any the two adjacent expansion cards. Each of the expansion cards has a heat dissipation channel and an expansion card fan. The expansion card fans are located in the heat dissipation channel. The heat dissipation channels are in fluid communication with the air flow channels. The air guide structure is disposed on one side of the expansion cards, and has an air inlet and an air outlet. The air inlet is in fluid communication with the air flow channels. The air outlet is in fluid communication with the heat dissipation channels. The external fan corresponds to the air inlet or the air outlet. The expansion card fan generates a first cooling airflow flowing into the heat dissipation channels. The external fan generates a second cooling airflow flowing into the airflow channels.

Description

Technical Field

[0001] This invention relates to an expansion card assembly and electronic device, particularly an expansion card assembly and electronic device equipped with an air guide structure and an external fan. Prior Technology

[0002] With the advent of the big data era and the continuous development of cloud technology, various industries are demanding increasingly higher performance from computing and processing units such as expansion cards. For example, in high-performance computing fields such as Artificial Intelligence (AI) computing, configuring multiple graphics cards has become an important means of improving computing power. As the amount of data that graphics cards need to process is becoming increasingly massive, the heat flux density and heat generation of graphics cards are also increasing significantly, making heat dissipation a pressing issue.

[0003] Generally, graphics cards have built-in fans to dissipate heat from the graphics chip inside. However, with multiple graphics cards densely packed together, the heat generated by the graphics chip during operation tends to accumulate and is difficult to dissipate, making the built-in fans inefficient in cooling the chip. Therefore, improving the heat dissipation efficiency of graphics cards is one of the problems that developers need to solve. Summary of the Invention

[0004] The present invention provides an expansion card assembly and an electronic device to improve the heat dissipation efficiency of the expansion card.

[0005] An expansion card assembly disclosed in one embodiment of the present invention is disposed in a housing and includes a plurality of expansion cards, an airflow structure, and at least one external fan. The expansion cards are disposed in the housing. The expansion cards are arranged side-by-side. An airflow channel is formed between any two adjacent expansion cards. Each expansion card has a heat dissipation channel and at least one expansion card fan. The expansion card fans are located in the heat dissipation channels. The heat dissipation channels are connected to the airflow channels. The airflow structure is disposed on one side of the expansion cards and has at least one air inlet and at least one air outlet. The at least one air inlet is connected to the airflow channels. The at least one air outlet is connected to the heat dissipation channels. The at least one external fan corresponds to the at least one air inlet or the at least one air outlet. The expansion card fans generate a first cooling airflow flowing into the heat dissipation channels. The at least one external fan generates a second cooling airflow flowing into the airflow channels. After the second cooling airflow flows into these airflow channels through at least one expansion card fan, the first cooling airflow and the second cooling airflow flow outward from at least one air outlet.

[0006] Another embodiment of the present invention discloses an electronic device comprising a housing and an expansion card assembly. The expansion cards are disposed in the housing. The expansion cards are arranged side-by-side. An airflow channel is formed between any two adjacent expansion cards. Each expansion card has a heat dissipation channel and at least one expansion card fan. The expansion card fans are located in the heat dissipation channels. The heat dissipation channels are connected to the airflow channels. An air guide structure is disposed on one side of the expansion cards and has at least one air inlet and at least one air outlet. At least one air inlet is connected to the airflow channels. At least one air outlet is connected to the heat dissipation channels. At least one external fan corresponds to at least one air inlet or at least one air outlet. The expansion card fans generate a first cooling airflow flowing into the heat dissipation channels. At least one external fan generates a second cooling airflow flowing into the airflow channels. After the second cooling airflow flows into the heat dissipation channels through at least one expansion card fan, the first cooling airflow and the second cooling airflow flow outward from at least one air outlet.

[0007] According to the expansion card assembly and electronic device of the above embodiments, since the expansion card assembly is equipped with these external fans, the external fans and the expansion card fans can be used together to dissipate heat from multiple expansion cards arranged side by side. In this way, compared with the existing multiple expansion cards arranged side by side relying solely on their own built-in fans for heat dissipation, this embodiment supplements the heat dissipation airflow by additionally providing these external fans. The heat dissipation airflow flows within the heat dissipation airflow channel formed by the air guide structure, airflow channel, and heat dissipation channel, which allows the heat dissipation airflow to flow evenly across the expansion card, thereby reducing hot spots on the expansion card and improving the heat dissipation efficiency of the expansion card to improve AI computing efficiency.

[0008] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Simple Explanation of the Diagram

[0009] Figure 1 is a perspective view of the electronic device according to the first embodiment of the present invention. Figure 2 is an exploded view of the expansion card assembly of the electronic device in Figure 1. Figure 3 is a cross-sectional schematic diagram of the expansion card assembly of the electronic device in Figure 1. Figure 4 is another cross-sectional view of the expansion card assembly of the electronic device in Figure 1. Figure 5 is another cross-sectional view of the expansion card assembly of the electronic device in Figure 1. Figure 6 is a perspective view of the expansion card assembly according to the second embodiment of the present invention. Figure 7 is another three-dimensional schematic diagram of the expansion card assembly in Figure 6. Figure 8 is an exploded view of the expansion card component in Figure 6. Figure 9 is a cross-sectional view of the expansion card assembly shown in Figure 6. Figure 10 is another cross-sectional view of the expansion card assembly in Figure 6. Figure 11 is another cross-sectional view of the expansion card assembly in Figure 6. Figure 12 is a perspective view of the expansion card assembly according to the third embodiment of the present invention. Figure 13 is another perspective view of the expansion card assembly in Figure 12. Figure 14 is an exploded view of the expansion card assembly in Figure 12. Implementation

[0010] Please refer to Figures 1 through 5. Figure 1 is a perspective view of the electronic device according to the first embodiment of the present invention. Figure 2 is an exploded view of the expansion card assembly of the electronic device of Figure 1. Figure 3 is a cross-sectional view of the expansion card assembly of the electronic device of Figure 1. Figure 4 is another cross-sectional view of the expansion card assembly of the electronic device of Figure 1. Figure 5 is another cross-sectional view of the expansion card assembly of the electronic device of Figure 1.

[0011] The electronic device 10 in this embodiment is, for example, an Artificial Intelligence (AI) server or a cloud server, and includes a housing 20 and an expansion card assembly 30. The expansion card assembly 30 includes multiple expansion cards 31, an airflow structure 32, and multiple external fans 33. The number of these expansion cards 31 is, for example, four, but is not limited thereto. These expansion cards 31 are, for example, graphics cards, and are disposed in the housing 20. These expansion cards 31 are arranged side by side, and an airflow channel CA is formed between any two adjacent expansion cards 31.

[0012] Each expansion card 31 has a heat dissipation channel CB, a plurality of expansion card fans 311, an expansion chip (not shown), and a heat sink (not shown). These heat dissipation channels CB are connected to these airflow channels CA. The expansion chip, the heat sink, and the expansion card fans 311 are located within these heat dissipation channels CB. These expansion card fans 311 generate a first cooling airflow into these heat dissipation channels CB. The heat sink is thermally coupled to the expansion chip, which may be, for example, a display chip. Furthermore, these expansion card fans 311 may be, for example, axial fans, but are not limited thereto.

[0013] In this embodiment, the first cooling airflow is used to dissipate heat from the expansion chip. Specifically, these expansion card fans 311 are located close to the heat sink fins and directly generate the first cooling airflow on the heat sink fins to reduce the distance the first cooling airflow travels to the heat sink fins, thereby reducing the loss of the first cooling airflow during flow and improving heat dissipation efficiency.

[0014] An air guide structure 32 is disposed on one side of these expansion cards 31, and the air guide structure 32 is made of high-strength materials such as plastic or metal to improve the structural stability of the air guide structure 32 and reduce its weight. The air guide structure 32 has multiple mounting holes (not shown) to allow it to be installed on expansion cards 31 of different sizes. These mounting holes are, for example, hollow cylindrical.

[0015] The air guide structure 32, the airflow channel CA, and the heat dissipation channel CB together constitute a heat dissipation airflow channel. Specifically, the air guide structure 32 includes two first frame portions 321 and a second frame portion 322. The two first frame portions 321 are connected to opposite sides of the second frame portion 322. Each of the two first frame portions 321 has an air inlet 3211. The two air inlets 3211 are connected to these airflow channels CA.

[0016] The second frame portion 322 includes a first plate 3221, a second plate 3222, and a third plate 3223. One side of the first plate 3221 and one side of the second plate 3222 are respectively connected to opposite sides of the third plate 3223. The other side of the first plate 3221 and the other side of the second plate 3222 are respectively connected to the side of the first frame portion 321 away from the expansion cards 31. The opposite sides of the first plate 3221, the second plate 3222, and the third plate 3223 have two air outlets 3224. The two air outlets 3224 are connected to the heat dissipation channels CB.

[0017] These external fans 33 correspond to two air inlets 3211 and two air outlets 3224, respectively. Specifically, these external fans 33 include two first external fans 331 and two second external fans 332. The two first external fans 331 are, for example, axial flow fans for air intake, and are respectively disposed at the two air inlets 3211 to generate a second cooling airflow flowing into these airflow channels CA. The second cooling airflow is used to dissipate heat from the expansion chip located within these cooling channels CB. The two second external fans 332 are, for example, axial flow fans for air exhaust, and are respectively disposed at the two air outlets 3224.

[0018] The two first external fans 331 and the two second external fans 332 can automatically adjust their speeds according to the temperature of the expansion chip and the AI ​​computing load, thereby achieving intelligent heat dissipation management. In addition, by adjusting the shape and speed of the fan blades of the two first external fans 331 and the two second external fans 332, and by using shock-absorbing materials to make the two first external fans 331 and the two second external fans 332, the noise generated by the two first external fans 331 and the two second external fans 332 during operation can be reduced.

[0019] In this embodiment, the second cooling airflow flowing into these airflow channels CA flows into these cooling channels CB through these expansion card fans 311 to cool the expansion chip located in these cooling channels CB together with the first cooling airflow. Then, the first cooling airflow and the second cooling airflow flow outward from the two air outlets 3224 through the two second external fans 332 in a direction perpendicular to the long side of these expansion cards 311.

[0020] In detail, the first and second cooling airflows, which absorb the heat generated by the expansion chip, are drawn out by the two second external fans 332. This creates a negative pressure zone in the airflow channels CA and CB, allowing the expansion card fans 311 and the two first external fans 331 to generate more of the first and second cooling airflows into the airflow channels CA and CB. Furthermore, the matching of the flow paths of the first and second cooling airflows reduces turbulence and eddies. This improves the heat dissipation efficiency of the expansion card 31.

[0021] In this embodiment, the air guiding structure 32 may further include multiple partitions 323. These partitions 323 are connected to the two first frame portions 321 and located at the two air inlets 3211. Each of the two first frame portions 321, near one side of the two air inlets 3211, and on the opposite sides of these partitions 323, has a guiding slope S. That is, the two first frame portions 321, near one side of the two air inlets 3211, and these partitions 323 form, for example, multiple funnel shapes. These guiding slopes S are used to guide the second heat dissipation airflow from the two air inlets 3211 into these airflow channels CA.

[0022] The first frame portion 321 and the partitions 323 abut against the expansion cards 31 to separate the two air inlets 3211 from the air outlets of the heat dissipation channels CB, so that the second heat dissipation airflow can only flow into the airflow channels CA from the two air inlets 3211 and will not mix with the heat dissipation airflow flowing to the two air outlets 3224, thereby avoiding a reduction in heat dissipation efficiency.

[0023] In this embodiment, since the expansion card assembly 30 is equipped with these external fans 33, these external fans 33 and the expansion card fans 311 can be used together to dissipate heat from multiple side-by-side expansion cards 31. In this way, compared with the existing multiple side-by-side expansion cards 31 that only rely on their own built-in fans for heat dissipation, this embodiment supplements the heat dissipation airflow by additionally providing these external fans 33. And by the heat dissipation airflow flowing in the heat dissipation airflow channel formed by the air guide structure 32, the airflow channel CA and the heat dissipation channel CB, the heat dissipation airflow can be evenly flowed through the expansion card 31 to reduce the hot spot area of ​​the expansion card 31, thereby improving the heat dissipation efficiency of the expansion card 31 and improving the AI ​​computing efficiency.

[0024] In this embodiment, there are two air inlets 3211, two air outlets 3224, two first external fans 331, and two second external fans 332, but this is not a limitation. In other embodiments, the number of air inlets, air outlets, first external fans, and second external fans may be one or more.

[0025] In this embodiment, the external fans 33 include two first external fans 331 and two second external fans 332, that is, the expansion card assembly 30 is provided with external intake fans and exhaust fans, but this is not a limitation. In other embodiments, the external fans may also include only two first external fans or two second external fans, that is, the expansion card assembly may also be provided with only external intake fans or exhaust fans.

[0026] In this embodiment, as shown in FIG3, when the expansion card fans 311 operate, a first cooling airflow is generated that flows into the heat dissipation channels CB along direction A1. Furthermore, when the two first external fans 331 operate, a second cooling airflow is generated that flows into the airflow channels CA from the two air inlets 3211 along direction B1. Then, the second cooling airflow flows within the airflow channels CA along direction C1, and through the expansion card fans 311, flows into the heat dissipation channels CB along direction D1 together with the first cooling airflow.

[0027] Next, as shown in Figure 4, the first and second cooling airflows flow together in direction E1 within these cooling channels CB, dissipating heat from the expansion chip located within these cooling channels CB. Then, as shown in Figure 5, the first and second cooling airflows flow together in direction F1 from these cooling channels CB to the second air outlet 3224, and then flow outwards from the second air outlet 3224 in direction G1 through the two second external fans 332. In this way, heat dissipation of the expansion chip is completed.

[0028] Please refer to Figures 6 through 11. Figure 6 is a perspective view of the expansion card assembly according to the second embodiment of the present invention. Figure 7 is another perspective view of the expansion card assembly of Figure 6. Figure 8 is an exploded view of the expansion card assembly of Figure 6. Figure 9 is a cross-sectional view of the expansion card assembly of Figure 6. Figure 10 is another cross-sectional view of the expansion card assembly of Figure 6. Figure 11 is another cross-sectional view of the expansion card assembly of Figure 6.

[0029] The expansion card assembly 30A in this embodiment is similar to the expansion card assembly 30 in the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, there are multiple air guide structures 32A. These air guide structures 32A do not include two first frame portions 321, a second frame portion 322, and multiple partitions 323 as in the air guide structure 32 of the first embodiment, but are in the form of multiple parallel strips.

[0030] Furthermore, there are two first external fans 331A, and the two first external fans 331A are located on opposite sides of these expansion cards 31. There is only one second external fan 332A, and the second external fan 332A is located at the air outlet 3224A. The two first external fans 331A are, for example, axial flow fans for air intake, and the second external fan 332A is, for example, a crossflow fan module for air output, and includes four fan blades 332A1. In addition, the housing of the second external fan 332A is integrally formed with the air guide structure 32, for example.

[0031] In this embodiment, there are two first external fans 331A, and the two first external fans 331A are disposed on opposite sides of these expansion cards 31, but this is not a limitation. In other embodiments, the number of first external fans may be only one, and the first external fan and the air guide structure are disposed on opposite sides of these expansion cards.

[0032] In this embodiment, the number of fan blades 332A1 is multiple, but not limited to this. In other embodiments, the number of fan blades may be three or less or five or more.

[0033] In this embodiment, as shown in Figures 9 and 10, when the expansion card fans 311 operate, a first cooling airflow is generated that flows into the heat dissipation channels CB along direction A2. Furthermore, when the two first external fans 331A operate, a second cooling airflow is generated that flows into the airflow channels CA along direction B2. Then, as shown in Figure 10, the second cooling airflow flows within the airflow channels CA along direction C2, and through the expansion card fans 311, flows into the heat dissipation channels CB along direction D2 together with the first cooling airflow.

[0034] Next, as shown in Figures 9 and 10, the first and second cooling airflows flow together in direction E2 within these cooling channels CB, dissipating heat from the expansion chip located within these channels CB. Then, the first and second cooling airflows flow together in direction F2 from these cooling channels CB to the outlet 3224A, and together through the second external fan 332A, flow outwards from the outlet 3224A in direction G2. In this way, heat dissipation of the expansion chip is completed.

[0035] Please refer to Figures 12 to 14. Figure 12 is a perspective view of the expansion card assembly according to the third embodiment of the present invention. Figure 13 is another perspective view of the expansion card assembly of Figure 12. Figure 14 is an exploded view of the expansion card assembly of Figure 12.

[0036] The expansion card assembly 30B in this embodiment is similar to the expansion card assembly 30 in the second embodiment. Therefore, the differences between this embodiment and the second embodiment will be described below, and the similarities will not be repeated. In this embodiment, there are multiple first external fans 331B, and these first external fans 331B are disposed on opposite sides of the air guide structure 32B. The second external fan 332B is disposed at the air outlet 3224B and includes four fan blades 332B1. Among them, these first external fans 331B are, for example, axial flow fans for air intake, and the second external fans 332B are, for example, crossflow fans for air output. In addition, the housing of the second external fan 332B is integrally formed with the air guide structure 32, for example.

[0037] Since the structure inside the second external fan 332B is similar to the structure inside the second external fan 332A in the second embodiment, and the structure inside the second external fan 332B is not the focus here, the structure inside the second external fan 332B is omitted in Figures 12 to 14, and the air outlet 3224B of the second external fan 332B is only shown schematically.

[0038] In this embodiment, the first external fans 331B are disposed on opposite sides of the air guide structure 32B, but this is not a limitation. In other embodiments, the first external fans may also be disposed on only one side of the air guide structure.

[0039] In this embodiment, the number of fan blades 332B1 is four, but it is not limited to this. In other embodiments, the number of fan blades may be three or less or five or more.

[0040] According to the expansion card assembly and electronic device of the above embodiments, since the expansion card assembly is equipped with these external fans, the external fans and the expansion card fans can be used together to dissipate heat from multiple expansion cards arranged side by side. In this way, compared with the existing multiple expansion cards arranged side by side relying solely on their own built-in fans for heat dissipation, this embodiment supplements the heat dissipation airflow by additionally providing these external fans. The heat dissipation airflow flows within the heat dissipation airflow channel formed by the air guide structure, airflow channel, and heat dissipation channel, which allows the heat dissipation airflow to flow evenly across the expansion card, thereby reducing hot spots on the expansion card and improving the heat dissipation efficiency of the expansion card to improve AI computing efficiency.

[0041] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

[0042] 10: Electronic devices 20: Chassis 30, 30A, 30B: Expansion Card Components 31: Expansion Card 311: Expansion Card Fan 32, 32A, 32B: Air guiding structure 321: First frame 3211: Air Inlet 322: Second frame 3221: First plate 3222: Second plate 3223: Third Plate 3224, 3224A, 3224B: Air vents 323: Separator 33, 33A, 33B: External fans 331, 331A, 331B: First external fan 332, 332A, 332B: Second external fan 332A1, 332B1: Fan blades A1~G1, A2~G2: Direction CA: Airflow Channel CB: Heat dissipation channel S: Guide ramp

Claims

1. An expansion card assembly for mounting in a chassis, the expansion card assembly comprising: a plurality of expansion cards mounted in the chassis, the expansion cards being arranged side-by-side, with an airflow channel formed between any two adjacent expansion cards, each of the expansion cards having a heat dissipation channel and at least one expansion card fan located in the heat dissipation channel and connected to the airflow channel; an air guide structure disposed on one side of the expansion cards, having at least one air inlet and at least one air outlet, the at least one air inlet connected to the airflow channel and the at least one air outlet connected to the heat dissipation channel; and at least one external fan corresponding to the at least one air inlet or the at least one air outlet; wherein, The expansion card fans are used to generate a first cooling airflow into the cooling channels, and the at least one external fan is used to generate a second cooling airflow into the airflow channels. After the second cooling airflow into the cooling channels passes through the at least one expansion card fan, the first cooling airflow and the second cooling airflow flow outward from the at least one air outlet in a direction perpendicular to the long side of the expansion cards.

2. The expansion card assembly as claimed in claim 1, wherein the number of the at least one external fan is multiple, and the external fans include multiple first external fans and multiple second external fans, the first external fans being disposed at the at least one air inlet, and the second external fans being disposed at the at least one air outlet.

3. The expansion card assembly as described in claim 2, wherein the number of the at least one air inlet and the at least one air outlet are two, and the air guiding structure includes two first frame portions and a second frame portion, the two first frame portions being connected to opposite sides of the second frame portion, the two first frame portions having the two air inlets, the second frame portion including a first plate, a second plate and a third plate, one side of the first plate and one side of the second plate being respectively connected to opposite sides of the third plate, the other side of the first plate and the other side of the second plate being respectively connected to the side of the two first frame portions away from the expansion cards, and the opposite sides of the first plate, the second plate and the third plate having the two air outlets.

4. The expansion card assembly as described in claim 3, wherein the air guide structure further includes a plurality of partitions connected to the two first frames and located at the two air inlets, and each of the two first frames having a guide slope on one side near the two air inlets and on the opposite sides of the partitions, the guide slopes being used to guide the second heat dissipation airflow from the two air inlets into the airflow channels.

5. The expansion card assembly as claimed in claim 1, wherein the number of the at least one external fan is multiple, and includes at least one first external fan and at least one second external fan, the at least one first external fan being disposed on the other side of the expansion cards, and the at least one second external fan being disposed at the at least one air outlet.

6. An electronic device comprising: a housing; and an expansion card assembly comprising: a plurality of expansion cards disposed in the housing, the expansion cards being arranged side-by-side, with an airflow channel formed between any two adjacent expansion cards, each of the expansion cards having a heat dissipation channel and at least one expansion card fan, the expansion card fans being located in the heat dissipation channels and the heat dissipation channels being connected to the airflow channels; an air guide structure disposed on one side of the expansion cards, having at least one air inlet and at least one air outlet, the at least one air inlet being connected to the airflow channels and the at least one air outlet being connected to the heat dissipation channels; and at least one external fan corresponding to the at least one air inlet or the at least one air outlet; wherein, The expansion card fans are used to generate a first cooling airflow into the cooling channels, and the at least one external fan is used to generate a second cooling airflow. The second cooling airflow enters the airflow channels from the at least one air inlet and flows into the cooling channels through the at least one expansion card fan. The first cooling airflow and the second cooling airflow flow outward from the at least one air outlet in a direction perpendicular to the long side of the expansion cards.

7. The electronic device as claimed in claim 6, wherein the number of the at least one external fan is multiple, and the external fans include multiple first external fans and multiple second external fans, the first external fans being disposed at the at least one air inlet, and the second external fans being disposed at the at least one air outlet.

8. The electronic device as claimed in claim 7, wherein the number of the at least one air inlet and the at least one air outlet are two, and the air guiding structure includes two first frame portions and a second frame portion, the two first frame portions being connected to opposite sides of the second frame portion, the two first frame portions having the two air inlets, the second frame portion including a first plate, a second plate and a third plate, one side of the first plate and one side of the second plate being respectively connected to opposite sides of the third plate, the other side of the first plate and the other side of the second plate being respectively connected to the side of the two first frame portions away from the expansion cards, and the opposite sides of the first plate, the second plate and the third plate having the two air outlets.

9. The electronic device as claimed in claim 8, wherein the airflow structure further comprises a plurality of partitions connected to the two first frames and located at the two air inlets, each of the two first frames having a guiding ramp on one side near the two air inlets and on the opposite sides of the partitions, the guiding ramps being used to guide the second heat dissipation airflow from the two air inlets into the airflow channels.

10. The electronic device as claimed in claim 6, wherein the number of the at least one external fan is multiple, and includes at least one first external fan and at least one second external fan, the at least one first external fan being disposed on the other side of the expansion cards, and the at least one second external fan being disposed at the at least one air outlet.

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