Package-on-package device with redistribution die

Abstract

A device includes a first substrate that includes a first set of contacts. The device also includes a redistribution die coupled to first contacts of the first set of contacts and to second contacts of the first set of contacts. The redistribution die includes conductors that electrically couple the first contacts of the first set of contacts to the second contacts of the first set of contacts. The device also includes a first integrated device coupled to third contacts of the first set of contacts. The device also includes a second integrated device coupled to a second substrate. The first substrate is disposed between the first integrated device and the second integrated device, and the first integrated device is electrically coupled to the second integrated device through the conductors of the redistribution die.