Semiconductor structure and methods of forming the same

TW202630767APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114117776
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-13
Filing Date
2025-05-12
Publication Date
2026-07-16
Patent Text Reader

Abstract

This disclosure is directed to a structure of a semiconductor device and a method of forming the structure. The structure includes a fin structure on a substrate. The fin structure includes channel layers. The structure further includes a gate structure surrounding each of the channel layers, a source / drain (S / D) region adjacent to the fin structure and in contact with the channel layers, an insulating layer adjacent to the S / D region, and a dielectric layer on the S / D region and the insulating layer. The structure further includes an S / D contact structure through the dielectric layer and in contact with the S / D region and the insulating layer. A bottom surface of the S / D contact structure is below a top surface of a bottommost channel layer of the channel layers.
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