Semiconductor device and method of manufacturing the same

TW202630780APending Publication Date: 2026-07-16MAGNACHIP SEMICON LTD
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Patent Information

Application Number
TW114139695
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-01
Filing Date
2025-10-15
Publication Date
2026-07-16
Patent Text Reader

Abstract

A semiconductor device includes an active area and a junction termination area, each including a drain electrode, a first epitaxial layer of a first conductivity type disposed on the drain electrode, and a second epitaxial layer of the first conductivity type disposed on the first epitaxial layer. The junction termination area further includes a first junction termination area etched on a portion of the second epitaxial layer , and a second junction termination area that is not etched. A field oxide layer is disposed on a portion of the first junction termination area. A doped region of a second conductivity type is disposed to extend from beneath the field oxide layer to the second junction termination area.
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