Semiconductor device and method of manufacturing the same
TW202630780APending Publication Date: 2026-07-16MAGNACHIP SEMICON LTD
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Patent Information
- Application Number
- TW114139695
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-01
- Filing Date
- 2025-10-15
- Publication Date
- 2026-07-16
Abstract
A semiconductor device includes an active area and a junction termination area, each including a drain electrode, a first epitaxial layer of a first conductivity type disposed on the drain electrode, and a second epitaxial layer of the first conductivity type disposed on the first epitaxial layer. The junction termination area further includes a first junction termination area etched on a portion of the second epitaxial layer , and a second junction termination area that is not etched. A field oxide layer is disposed on a portion of the first junction termination area. A doped region of a second conductivity type is disposed to extend from beneath the field oxide layer to the second junction termination area.
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