Semiconductor device and method of making high profile and heavy modules

Abstract

A semiconductor device has a first substrate. A first semiconductor package is disposed over a first surface of the first substrate. A second semiconductor package is disposed over the first surface of the first substrate. A connector is disposed over the first surface of the first substrate. A first inductor is disposed over a second surface of the first substrate opposite the first semiconductor package. A second inductor is disposed over the second surface of the first substrate opposite the second semiconductor package. A pin header is disposed over the second surface of the first substrate opposite the connector. The first substrate is disposed over a board with the first inductor and second inductor between the first substrate and board.