Semiconductor device and method of manufacturing the same

Abstract

An embodiment semiconductor device includes a substrate having a first side and a second side opposite the first side; a first set of electronic components at the first side of the substrate; and an isolation structure at the second side of the substrate, and overlapping the first set of electronic components based on a perspective along a vertical direction. The isolation structure includes an array of conductive strips, and an open guard ring structure that extends along a periphery of the array of conductive strips and defines a space between two ends of the open guard ring structure. The semiconductor device further includes a passive component or a second set of electronic components at the second side of the substrate.

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