Transfer equipment

Abstract

A transfer equipment for processing a die arrangement. The die arrangement includes a transparent substrate, a plurality of dies and a first adhesive layer connecting the transparent substrate and the dies. The transfer equipment includes a first platform, a stamp head, and a laser source. The first platform carries the die arrangement. The stamp head is located along a first direction that is perpendicular to the first platform to move a first die of the dies away from the transparent substrate, and is movable along a second direction, wherein the first direction is not parallel to the second direction. The laser source is used to provide a laser that passes through the transparent substrate and irradiates the first adhesive layer. The first adhesive layer includes polymer material. When the laser irradiates the first adhesive layer, the die arrangement contacts the first platform and the stamp head at the same time.

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