Etching equipment and etching method
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SILICONWARE PRECISION IND CO LTD
- Filing Date
- 2025-01-14
- Publication Date
- 2026-07-16
AI Technical Summary
Current semiconductor device manufacturing methods require manual control of the exhaust control valve for etching solution concentration, leading to risks of negligence and safety hazards due to manual operation on elevated platforms.
An etching apparatus and method that utilize a sensing device to automatically control the ventilation device based on the number of parts to be etched within a specific time period, ensuring the etching solution concentration is maintained by starting or stopping ventilation operations as needed.
Automated control of ventilation in the etching process prevents over-etching or incomplete etching by maintaining optimal solution concentration, reducing safety risks and operational errors.
Smart Images
Figure TWG2TA001068107_001 
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Abstract
Description
[Technical Field]
[0001] This invention relates to a semiconductor device, and more particularly to an etching device and etching method for a semiconductor device. [Previous Technology]
[0002] Current semiconductor device manufacturing methods require various wet processes, such as etching, cleaning, and electroplating. Taking the etching process as an example, during the etching operation, the machine continuously adds etching solution. At this time, the exhaust control valve needs to be manually opened to maintain the concentration of etching solution in the main chamber of the machine. If the machine continues to add etching solution and the exhaust control valve is not opened, the concentration of etching solution will become too high, resulting in over-etching.
[0003] In contrast, if the etching operation is completed and the machine stops adding etching solution, the exhaust control valve must be closed within a certain period of time to maintain the concentration of etching solution in the main chamber of the machine. If the exhaust control valve is not closed, the concentration of etching solution will decrease, resulting in incomplete etching.
[0004] However, at present, the opening or closing of the exhaust control valve is controlled manually. Not only is it easy to forget to start or close it, but also, the opening or closing requires the staff to climb up to the machine platform, which is prone to the risk of falling.
[0005] Therefore, how to overcome the problems of the aforementioned conventional technology has become an urgent issue to be addressed. [Summary of the Invention]
[0006] In view of the various deficiencies of the prior art, the present invention provides an etching apparatus, comprising: an etching machine; a ventilation device physically connected to the etching machine for ventilating the air inside the etching machine; and a sensing device signal-connected to the ventilation device for counting the number of parts to be etched entering the etching machine within a specific time period, thereby activating the ventilation device.
[0007] The present invention further provides an etching method, comprising: using a sensing device to count the number of parts to be etched entering an etching machine within a specific time period; if the number of parts to be etched is greater than or equal to a preset value, the sensing device sends a signal to a ventilation device to start the ventilation device to perform ventilation operation on the etching machine; and if the number of parts to be etched does not change, the sensing device sends a signal to the ventilation device to stop the ventilation device from performing ventilation operation on the etching machine.
[0008] In the aforementioned etching equipment and etching method, the etching machine includes a main chamber and a feed track, wherein the feed track is connected to the main chamber so that the workpiece to be etched enters the main chamber via the feed track for etching operation.
[0009] In the aforementioned etching equipment and etching method, the ventilation device is an exhaust device.
[0010] In the aforementioned etching equipment and etching method, the workpiece to be etched is a semiconductor device.
[0011] In the aforementioned etching equipment and etching method, the specific time is 3 minutes, and the number of the parts to be etched is greater than or equal to 3, the ventilation device is started.
[0012] In the aforementioned etching equipment and etching method, the specific time is 3 minutes, and the number of the workpieces to be etched remains unchanged, the ventilation device is turned off.
[0013] As can be seen from the above, the etching equipment and etching method of the present invention mainly utilize a sensing device that connects the etching machine and the ventilation device to automatically start the ventilation device when a predetermined number of parts to be etched enter the etching machine within a specific time period, or to automatically shut down the ventilation device when no parts to be etched enter the etching machine within a specific time period, so as to maintain the concentration of etching solution in the etching machine. [Simplified Explanation of the Diagram]
[0032] Figure 1 is a flowchart of the etching method of the present invention.
[0033] Figure 2 is a schematic diagram of the etching equipment of the present invention.
[0034] Figure 3 is an example of the implementation flowchart of the etching method of the present invention.
Implementation Method
[0014] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0015] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only used to complement the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms such as "above," "first," "second," and "a" used in this specification are only for the clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.
[0016] Please refer to Figures 1 and 2 at the same time. Figure 1 is a flowchart of the etching method of the present invention, which includes steps S11 to S14. Figure 2 is a schematic diagram of the etching equipment 2 of the present invention, which includes an etching machine 21, a sensing device 22 and a ventilation device 23.
[0017] In step S11: a loading operation is performed, in which the workpiece 3 to be etched is sent to the feed track 211 of the etching machine 21. The workpiece 3 to be etched is, for example, a semiconductor device such as a wafer or a substrate.
[0018] In step S12: a sensing operation is performed. The number (n) of the workpieces 3 to be etched on the feed track 211 is calculated by the sensing device 22 within a specific time (t). For example, a sensor is set on the feed track 211. The sensor can detect whether the number of workpieces 3 to be etched on the feed track 211 has reached a set value or has not changed, so as to determine whether to proceed to step S13 or step S14.
[0019] In step S13: If the number of the workpieces 3 to be etched on the feed track 211 is greater than or equal to a preset value (e.g., n ≥ 3) within a specific time (e.g., t = 3 minutes), the sensing device 22 sends a signal to the ventilation device 23 physically connected to the etching machine 21 to start the ventilation device 23, and the etching machine 21 continues to supply etching solution to perform etching operation on the workpieces 3 to be etched. At this time, due to the start of the ventilation device 23, the gas in the main chamber 212 of the etching machine 21 can be ventilated to maintain the concentration of etching solution in the main chamber 212 of the etching machine 21.
[0020] In step S14: Relatively speaking, within a specific time (e.g., t=3 minutes), if the number of the workpieces 3 to be etched on the feed track 211 does not change (e.g., n=0), the sensing device 22 sends a signal to the ventilation device 23 to close the ventilation device 23, and the etching machine 21 stops supplying etching solution. At this time, due to the closure of the ventilation device 23, the gas in the main chamber 212 of the etching machine 21 is ventilated, and the concentration of etching solution in the main chamber 212 of the etching machine 21 can be maintained.
[0021] The present invention further discloses an etching apparatus 2, which includes: an etching machine 21, a ventilation device 23 physically connected to the etching machine 21, and a sensing device 22 signal connected to the ventilation device 23.
[0022] The etching machine 21 includes a main chamber 212 and a feed track 211. The feed track 211 is connected to the main chamber 212 so that the workpiece 3 to be etched can enter the main chamber 212 via the feed track 211 for etching. The workpiece 3 to be etched is, for example, a semiconductor device such as a wafer or a substrate.
[0023] The ventilation device 23 is, for example, an exhaust device, which is physically connected to the etching machine 21 and performs ventilation operations in the main chamber 212 of the etching machine 21, such as exhaust replacement operations.
[0024] The sensing device 22 is connected to the ventilation device 23 to count the number of parts 3 to be etched entering the etching machine 21 within a specific time period, and to actuate (such as start or stop) the ventilation device 23 accordingly.
[0025] Please refer to Figure 3, which is an illustrative flowchart of one of the etching methods of the present invention, including steps S31 to S34.
[0026] In step S31: Perform a packaging operation to form a packaging colloid on the semiconductor device.
[0027] In step S32: a marking operation is performed to form laser markings on the encapsulating colloid.
[0028] In step S33: an etching operation is performed, in which the semiconductor device (the part to be etched) is sent to the etching machine to remove the metal protective layer using etching solution, thereby exposing the electrical contacts. This includes step S331, loading the part (the part to be etched) using a robotic arm or manually; step S332, sending the part to be etched to the feed track of the etching machine; step S333, sensing and calculating the number of parts to be etched passing through the feed track to provide a basis for actuating (starting or stopping) the ventilation device; step S334, sending the part to be etched into the main chamber of the etching machine for etching; step S335, treating the part to be etched with etching solution; step S336, performing a water washing operation; step S337, performing a drying or blowing operation; and step S338, unloading the part using a robotic arm or manually.
[0029] In step S34: perform high-pressure cleaning to remove process residues and impurities.
[0030] In summary, the etching equipment and etching method of the present invention mainly utilize a sensing device connected to the etching machine and the ventilation device to automatically start the ventilation device when a predetermined number of parts to be etched enter the etching machine within a specific time period, or to automatically shut down the ventilation device when no parts to be etched enter the etching machine within a specific time period, so as to maintain the concentration of etching solution in the etching machine and avoid the risks of negligence and forgetting to operate when the ventilation device is manually started or stopped in the conventional way.
[0031] The above embodiments are used to illustrate the principles and effects of the present invention, and are not intended to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.
Claims
1. An etching apparatus, comprising: Etching machine, including a feed track; A ventilation device is physically connected to the etching machine to perform ventilation operations inside the etching machine. And a sensing device, which is connected to the ventilation device, to count the number of parts to be etched that enter the etching machine through the feed track within a specific time period, and to activate the ventilation device accordingly.
2. The etching apparatus as described in claim 1, wherein, The etching machine includes a main chamber.
3. The etching apparatus as described in claim 2, wherein, The feed track is connected to the main chamber, allowing the workpiece to be etched to enter the main chamber via the feed track for etching.
4. The etching apparatus as described in claim 1, wherein, The ventilation device is an exhaust system.
5. The etching apparatus as described in claim 1, wherein, The part to be etched is a semiconductor device.
6. The etching apparatus as described in claim 1, wherein, If the number of the workpieces to be etched is greater than or equal to a preset value within a specific time period, the sensing device sends a signal to the ventilation device to activate the ventilation device.
7. The etching apparatus as described in claim 1, wherein, If the number of the workpiece to be etched does not change within a specific time period, the sensing device sends a signal to the ventilation device to shut down the ventilation device.
8. The etching apparatus as described in claim 1, wherein, The ventilation device is activated when the specific time is 3 minutes and the number of parts to be etched is greater than or equal to 3.
9. The etching apparatus as described in claim 1, wherein, The ventilation device is turned off when the specific time is 3 minutes and the number of parts to be etched remains unchanged.
10. An etching method, comprising: The number of parts to be etched that enter the etching machine through the feed track of the etching machine is counted within a specific time period using a sensing device. If the number of the workpieces to be etched is greater than or equal to a preset value, the sensing device sends a signal to the ventilation device to start the ventilation device to perform ventilation operation on the etching machine; and if the number of the workpieces to be etched does not change, the sensing device sends a signal to the ventilation device to stop the ventilation device from performing ventilation operation on the etching machine.
11. The etching method as described in claim 10, wherein, The etching machine includes a main chamber.
12. The etching method as described in claim 11, wherein, The feed track is connected to the main chamber, allowing the workpiece to be etched to enter the main chamber via the feed track for etching.
13. The etching method as described in claim 10, wherein, The ventilation device is an exhaust system.
14. The etching method as described in claim 10, wherein, The part to be etched is a semiconductor device.
15. The etching method as described in claim 10, wherein, The ventilation device is activated when the specific time is 3 minutes and the number of parts to be etched is greater than or equal to 3.
16. The etching method as described in claim 10, wherein, The ventilation device is turned off when the specific time is 3 minutes and the number of parts to be etched remains unchanged.