Semiconductor processing equipment

Abstract

This invention provides a semiconductor processing apparatus, comprising: at least two processing chambers sharing a single vacuum pumping device; each processing chamber includes: a base for supporting a wafer; a gas-blocking ring surrounding the base, dividing the space within the processing chamber into a wafer processing area and a gas replenishment and pressure regulation area with interconnected gas paths; and a bottom inner liner ring dividing the gas replenishment and pressure regulation area into a gas replenishment area and a pressure regulation area. The gas replenishment area has an external gas supply path, and the pressure regulation area has a gas supply path connecting the gas replenishment area, the wafer processing area, and the vacuum pumping device. The bottom inner liner ring has multiple first vent holes connecting the gas replenishment area and the pressure regulation area. By adjusting the distribution of the first vent holes, the flow rate of the replenished gas injected into the pressure regulation area is adjusted in different regions to achieve a uniform distribution of the airflow field within the wafer processing area.

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