Wafer bonding apparatus and wafer holding module

Abstract

The present invention provides a wafer bonding apparatus and a wafer fixing module, comprising: a frame; a first fixing module formed on a portion of the frame and fixing a first wafer; and a second fixing module for fixing the second wafer by means of bonding the second wafer to the first wafer, and formed in a manner corresponding to the first fixing module; the first fixing module is formed to be spaced apart from the frame as a whole, and can be supported on the frame in a multi-point support manner.

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