Automatic editing apparatus for chip on film

Abstract

This invention relates to an automatic editing device for flip-chip films, comprising: a cutting section for cutting defective portions of the film; a joining section disposed on the side of the cutting section for joining the upper and lower surfaces of the cut film with adhesive tape; and a transfer section disposed between the cutting section and the joining section for transferring the cut film to the joining section by clamping the upper and lower surfaces of the film. The transfer section is provided with a first clamping member (41) and a second clamping member (42), and is capable of contacting and clamping the upper and lower surfaces of the film and then moving laterally to transfer the film. The joining section comprises: a first joining platform (51) with a first vacuum hole formed on its upper surface for adsorbing and supporting the lower surface of the film; a second joining platform (53) with a second vacuum hole formed on its lower surface for adsorbing and supporting the upper surface of the film; an adhesive tape support frame (55) with a vacuum hole formed on its upper surface for adsorbing and supporting the adhesive tape; a first camera (C1) for confirming the alignment of the film placed on the first joining platform; and a second camera (C2) for confirming the alignment of the adhesive tape placed on the adhesive tape support frame.