Monitoring methods, systems and storage media

TW202630917APending Publication Date: 2026-07-16TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2025-10-21
Publication Date
2026-07-16

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Abstract

The purpose of this invention is to more easily and accurately monitor whether substrate processing is normal. The monitoring method of this invention is a monitoring method for substrate processing performed by substrate processing system 1. The monitoring method includes an acquisition step, acquiring at least a plurality of monitoring values ​​containing information related to the cleanliness of the processing fluid supplied to workpiece W. The monitoring method includes a calculation step, calculating scores for each of the acquired plurality of monitoring values, and calculating a composite score combining all the scores. The monitoring method includes a display step, displaying the composite score.
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