Semiconductor structure and method for forming the same
TW202630939APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114124272
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-05-01
- Filing Date
- 2025-06-27
- Publication Date
- 2026-07-16
Abstract
A semiconductor structure is provided. The semiconductor structure includes a first source / drain feature over a first fin element, a second source / drain feature over a second fin element and a first gate stack and a second gate stack across the first fin element and the second fin element. The semiconductor structure further includes a dielectric layer covering the second source / drain feature and the first source / drain feature, an isolation feature interposed between the first source / drain feature and the second source / drain feature, and between the first gate stack and the second gate stack. The semiconductor structure further includes a contact structure in the dielectric layer and electrically coupled to the first source / drain feature by way of a silicide layer.
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