Semiconductor structure and method for forming the same

TW202630939APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114124272
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-05-01
Filing Date
2025-06-27
Publication Date
2026-07-16
Patent Text Reader

Abstract

A semiconductor structure is provided. The semiconductor structure includes a first source / drain feature over a first fin element, a second source / drain feature over a second fin element and a first gate stack and a second gate stack across the first fin element and the second fin element. The semiconductor structure further includes a dielectric layer covering the second source / drain feature and the first source / drain feature, an isolation feature interposed between the first source / drain feature and the second source / drain feature, and between the first gate stack and the second gate stack. The semiconductor structure further includes a contact structure in the dielectric layer and electrically coupled to the first source / drain feature by way of a silicide layer.
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