Semiconductor device with storage node and method of fabricating the same
TW202630940APending Publication Date: 2026-07-16SK HYNIX INC
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Patent Information
- Application Number
- TW114140399
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-31
- Filing Date
- 2025-10-20
- Publication Date
- 2026-07-16
Abstract
A semiconductor device including a storage node and a method of fabricating the same is provided. In the method of fabricating the semiconductor device, an insulation layer is formed over a substrate, and a first hole and a second hole that penetrate the insulation layer are formed. A recess is formed in the insulation layer to overlap the first hole. A first conductive pattern that fills the first hole and the recess and a second conductive pattern that fills the second hole are formed. A third conductive pattern connected to the second conductive pattern is formed.
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