Semiconductor package with integrated heat sink, panel-shaped array of heat sink units, and related manufacturing method

Abstract

A semiconductor package with an integrated heat sink is disclosed. The semiconductor package includes at least one semiconductor die considered as a primary heat source. A heat sink partially embedded in the encapsulation material is coupled to the backside of the semiconductor die. The heat sink comprises at least one connection rib, and the connection rib is coated with an encapsulating material. Even if the semiconductor package is turned over, the encapsulation material can still provide enough mechanical support for the heat sink unit through contact with the connection rib, so as to ensure that the heat sink unit is firmly fixed and is not easy to fall off.

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