Cover and wafer packaging structure for wafer packaging

Abstract

A polycrystalline diamond composite material is used for thermally conductive elements, heat sinks, cover bodies for chip packaging, and chip packaging structures. The chip packaging structure includes one or more chips, one or more thermal interface materials, and a heat dissipation cover body. The thermal interface materials are in contact with the chips. The heat dissipation cover body includes a body and a polycrystalline diamond body. The body includes a horizontal wall portion and a vertical wall portion. The vertical wall portion connects to a periphery of the horizontal wall portion. The horizontal wall portion and the vertical wall portion together define a groove. The horizontal wall portion has a through hole. The polycrystalline diamond body is disposed in the through hole. The polycrystalline diamond body makes thermal contact with the chip and is used to remove one or more hot spots on the chip.

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