Lead frame and manufacturing method of lead frame

TW202630960APending Publication Date: 2026-07-16MITSUI HIGH TEC INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
MITSUI HIGH TEC INC
Filing Date
2025-10-01
Publication Date
2026-07-16

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Abstract

A lead frame includes a unit lead frame having a chip pad and a lead. Furthermore, the unit lead frame has a concave portion on the surface. In addition, the surface roughness inside the concave portion is greater than the surface roughness around the concave portion.
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