Temporary fixing substrate and method for manufacturing temporary fixing substrate

Abstract

The object of this invention is to provide a temporary fixing substrate suitable for suppressing the occurrence of cracks when temporarily fixing a semiconductor wafer. The solution is a temporary fixing substrate made of a ceramic sintered body, on which a predetermined object is temporarily fixed, and comprising: a small-particle-size region, wherein at least a portion of the outer periphery of an annular portion measuring a predetermined width from the side end has a main component ceramic particle grain size smaller than the main component ceramic particle grain size in the main portion outside the outer periphery.

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