Semiconductor structures and methods for forming the same

Abstract

A semiconductor structure that suppresses moisture-induced delamination may be provided by forming an interposer including first redistribution wiring interconnects embedded within first redistribution dielectric layers; forming die-side bump structures and dummy bump structures on a respective one of the first redistribution wiring interconnects; and attaching at least one semiconductor die including a respective array of on-die bump structures to a respective subset of the die-side bump structures of the interposer. The dummy bump structures are not bonded to any of the at least one semiconductor die due to a vertical gap between the dummy bump structures and the at least one semiconductor die.