Semiconductor module packaging structure

Abstract

A semiconductor module packaging structure includes a prefabricated layer, at least one die, an insulating material layer and a customized layer. The prefabricated layer includes a plurality of multi-layer circuit boards. The multi-layer circuit boards are individually arranged independently and side by side. The at least one die is disposed on the prefabricated layer. The insulating material layer is disposed on the prefabricated layer and covers the at least one die. The customized layer is disposed on the insulating material layer and electrically connected to the prefabricated layer.

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