Composite microparticles

Abstract

In one embodiment, this invention relates to a composite particle, wherein a portion of the surface of copper microparticles is coated with an ethylene-based polymer P, and the primary particle size of the composite microparticles is 50 nm to 300 nm, and the ratio of carbon content (mass%) to BET specific surface area (m² / g) of the composite microparticles (carbon content / BET specific surface area) is 0.020 to 0.060. In another embodiment, this invention relates to a composite microparticle dispersion comprising the aforementioned composite microparticles. In yet another embodiment, this invention relates to a wiring pattern or bonding layer, which is a heat-treated product of the aforementioned composite microparticle dispersion.