Conductive paste, sintered body and semiconductor device

Abstract

This invention provides a conductive paste that is not prone to voids or cracks. A conductive paste comprises metal particles and a solvent, wherein the metal particles comprise first nanoparticles with an average particle diameter of 80 nm to 500 nm, and when subjected to thermogravimetric analysis in a nitrogen atmosphere starting at 25°C or below at a heating rate of 10°C / min, satisfies the following [1] and [2]. [1] The weight retention rate at 120°C is ≥98%. [2] The weight reduction rate Δ120°C-160°C from 120°C to 160°C is 2.0% to 5.0%.

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