Soldering device and method for manufacturing soldered object

Abstract

A soldering device includes a heating and cooling unit configured to heat and cool an object to be soldered by at least one of thermal conduction or thermal radiation, and a first distance adjusting mechanism configured to adjust a distance between the object and the heating and cooling unit. A method for manufacturing a soldered object includes, by using the soldering device, placing the object at a first predetermined distance away from the heating and cooling unit, heating the heating and cooling unit, after the heating, moving the object closer to the heating and cooling unit to heat the object, after the solder has melted, placing the object at a second predetermined distance away from the heating and cooling unit, cooling the heating and cooling unit, and after the cooling, moving the object closer to the cooled heating and cooling unit to cool the solder contained in the object.

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