Apparatus configured to bond an electronic component

Abstract

An apparatus configured to bond an electronic component including a bonding mechanism, a carrying platform, a confirming-image capturing mechanism, a positioning-image capturing mechanism, an energy-generating mechanism and a control unit is provided. The bonding mechanism includes a bonding head with a reference mark and a positioning mark. The bonding head could grab an electronic component to be bonded and place it at a desired bonding position for bonding. The carrying platform is used to carry a substrate to be bonded. The carrying platform and the bonding head are arranged oppositely. The confirming-image capturing mechanism captures an image between the reference mark and the electronic component. The positioning-image capturing mechanism captures an image of part of the substrate through the positioning mark. The energy-generating mechanism provides energy to the bonding head to perform bonding. The control unit instructs the bonding head and / or the carrying platform to operate based on an information from the confirming-image capture mechanism and completes the bonding operation.

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