Laser processing equipment, microscope equipment and laser processing methods

TW202631290APending Publication Date: 2026-08-01HAMAMATSU PHOTONICS KK
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-11-11
Publication Date
2026-08-01

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Abstract

The laser processing apparatus disclosed herein includes: a laser output unit for outputting lasers with a wavelength of 1... Laser light with a pulse width of less than ps; a polarization adjustment unit that receives incident laser light output from the laser output unit, adjusts the polarization direction of the laser light such that the laser light includes a first component in a first polarization direction and a second component in a second polarization direction orthogonal to the first polarization direction, and emits the adjusted laser light; a spatial light modulator that receives incident laser light emitted from the polarization adjustment unit, modulates the first component of the laser light and emits it as modulated light, and emits the second component of the laser light as unmodulated light; a focusing unit that focuses the modulated light and the unmodulated light emitted from the spatial light modulator toward the object, thereby forming a continuous irradiation area on the object including the modulated light and the unmodulated light; and a scanning unit that scans the irradiation area on the object.
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