Laser processing methods

Abstract

The purpose of this invention is to provide a laser processing method that allows for the free formation of processing patterns within a laser processing apparatus. The laser processing apparatus 100 includes: an illumination optical unit 20, a masking platform 40, and a processing platform 50. Simultaneously with the switching of the angle switching mirror in the illumination optical unit 20 and the masking by the masking unit 25, the scanning mechanism 60 and the processing platform 50, or one of them, are driven and controlled to adjust the scanning start position of each masking pattern and the processing start position of the processing zone of the substrate W, determined according to process parameters.

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