Laser processing equipment, microscope equipment and laser processing methods

Abstract

The laser processing apparatus of the present invention includes: a placement section for placing an object; a laser irradiation section for irradiating a first laser light and a second laser light; and a transmission member disposed between the object placed in the placement section and the laser irradiation section, positioned on the optical axis of the first laser light and the second laser light, allowing the first laser light and the second laser light to pass through; and focusing the first laser light and the second laser light in such a way that at least a portion of the region where the intensity of the second irradiation region reaches its peak when viewed from the optical axis direction of the first laser light is located outside the region where the intensity of the first irradiation region reaches its peak.

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