Soldering method
TW202631297APending Publication Date: 2026-08-01ALPHA ASSEMBLY SOLUTIONS INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ALPHA ASSEMBLY SOLUTIONS INC
- Filing Date
- 2023-11-20
- Publication Date
- 2026-08-01
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Figure TWG2TA001071871_001 
Figure TWG2TA001071871_002
Abstract
A soldering method comprising: providing a solder paste between two or more work pieces to be joined, the solder paste comprising solder particles dispersed in a paste flux; and subjecting the solder paste to a temperature profile to reflow the solder particles and form a solder joint between the two or more work pieces, wherein, when the paste flux is subjected to thermogravimetric analysis according to ASTM
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