Control of head sweep

Abstract

Systems and methods for determining values for a plurality of control parameters to minimize a difference between a target removal profile and an expected removal profile, the plurality of control parameters representing at least a first duration and a second duration and cause the carrier head to, for the first duration, moving the substrate laterally across the polishing pad such that the central region and the edge region of the substrate are positioned over a polishing surface of the polishing pad, and for the second duration, hold the substrate in a substantially laterally fixed position such that the central region of the substrate is positioned over the polishing surface of the polishing pad and the at least a portion of the edge region of the substrate is positioned over a polishing control groove of the polishing pad.

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