Polishing pad for maintaining transmittance and preparation method thereof
TW202631311APending Publication Date: 2026-08-01SK ENPULSE CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SK ENPULSE CO LTD
- Filing Date
- 2025-10-16
- Publication Date
- 2026-08-01
Smart Images
Figure TWG2TA001070894_001 
Figure TWG2TA001070894_002 
Figure TWG2TA001070894_003
Abstract
The polishing pad according to an embodiment comprises a top pad having three or more penetrating holes and a plurality of grooves; and a window block inserted into the lower part of each of the penetrating holes, wherein the upper part of each penetrating hole that is not filled with the window block forms a pit, the ratio of the depth of the pit to the thickness of the top pad is
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