Substrate polishing head for optical enhancement analysis
TW202631312APending Publication Date: 2026-08-01APPLIED MATERIALS INC
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2025-09-24
- Publication Date
- 2026-08-01
Smart Images
Figure TWG2TA001070530_001 
Figure TWG2TA001070530_002 
Figure TWG2TA001070530_003
Abstract
The present disclosure relates to a polishing head for a chemical mechanical polishing tool. In one embodiment, a polishing head, includes a housing, a perforated plate coupled to the housing, a flexible membrane disposed in the housing, and a retaining ring disposed around the membrane. The perforated plate includes a plurality of apertures disposed through the perforated plate. The plurality of apertures perforate at least
Need to check novelty before this filing date? Find Prior Art