Semiconductor tool and method of grinding semiconductor wafer

Abstract

A semiconductor tool includes a grinding wheel configured to rotate around a first axis, a chuck table configured to rotate around a second axis offset from the first axis, and a plurality of adjustment shafts disposed at a peripheral portion of the chuck table. The chuck table includes an edge contour where an edge of the grinding wheel is projected onto the chuck table, and a wheel center where a center of the grinding wheel is projected onto the chuck table. The plurality of adjustment shafts are configured to adjust an inclination of the chuck table, wherein each of the plurality of adjustment shafts are disposed on an extending line extending from the wheel center toward a point on the edge contour.

Images