Processing equipment and support table

TW202631315APending Publication Date: 2026-08-01TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
TW114137050
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-18
Filing Date
2025-09-25
Publication Date
2026-08-01

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Abstract

The present invention addresses the problem of measuring machining load in conventional machining apparatuses. The present invention provides a machining apparatus that brings a tool into contact with a rotating workpiece and processes the workpiece. The apparatus includes a support platform rotatably supporting the workpiece, the support platform supporting the workpiece on a support surface, and at least one sensor unit for measuring the force applied to the support surface.
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