Diamond polishing pad conditioner and manufacturing method thereof
TW202631316AInactive Publication Date: 2026-08-01NIPPONALLOYCO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- NIPPONALLOYCO LTD
- Filing Date
- 2025-01-23
- Publication Date
- 2026-08-01
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 00000000_0000_ABST
Abstract
A diamond polishing pad conditioner manufacturing method includes the following steps of providing a substrate, providing a plurality of diamond particles, fixing the diamond particles on the substrate, and forming a selective covering protective layer with a predetermined thickness. A selective covering protective layer is formed on the substrate, and the diamond particles are automatically exposed. In addition, a diamond polishing pad conditioner is also disclosed herein.
Need to check novelty before this filing date? Find Prior Art