Diamond conditioner manufacturing equipment and diamond conditioner manufacturing method

Abstract

A diamond conditioner manufacturing equipment includes a working chamber and a supporting base. The supporting base is arranged in the working chamber, the supporting base includes an oscillator and a heater, and the supporting base is utilized to fix a diamond disc. In addition, a protective layer is coated on the diamond disc at a predetermined temperature and a predetermined oscillation frequency and below a predetermined pressure. In addition, a diamond conditioner manufacturing method is also disclosed herein.

Description

Technical Field

[0001] The present invention relates to a manufacturing device and a manufacturing method of a dresser, and more particularly to a manufacturing device and a manufacturing method of a diamond dresser. Prior Art

[0002] As the domestic and international semiconductor markets have flourished in recent years due to the demand for materials for computers and their peripheral products, the semiconductor industry has continued to expand and created a large amount of foreign exchange income.

[0003] The production process of semiconductor components is very complicated, and the technologies involved cover almost all the most important and key technologies and inventions in the development of modern human science. Therefore, the production of semiconductor components is not only a cutting-edge technology industry, but also an industry that requires huge funds to maintain development.

[0004] Chemical mechanical polishing is an indispensable key technology in the semiconductor manufacturing process. In order to ensure the stability and continuity of the chemical mechanical polishing process and maintain the quality of the wafer, the polishing pad must be properly dressed with a dresser to restore its surface morphology and characteristics.

[0005] There are still some problems in using a dresser to dress the polishing pad, such as the polishing pad may cause metal contamination in the semiconductor process, the flatness of the dresser may be uneven, or the cutting rate of the dresser may change, thereby affecting the stability of the semiconductor process.

[0006] How to effectively improve the stability of the grinding removal rate of the dresser and reduce the contamination that may be caused by the dresser will help improve the reliability, efficiency and production yield of semiconductor production. Summary of the invention

[0007] The invention summary is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This invention summary is not a complete overview of the present disclosure, and it is not intended to point out the important / critical elements of the embodiments of the present invention or to define the scope of the present invention.

[0008] One purpose of the present invention is to provide a manufacturing device and a manufacturing method for a diamond dresser, which can improve the quality and performance of the diamond dresser, thereby improving the quality and stability of semiconductor production.

[0009] To achieve the above-mentioned purpose, one technical aspect of the present invention is a manufacturing device for a diamond dresser, which includes a working chamber and a base. The base is arranged in the working chamber, includes an oscillator and a heater, and fixes a diamond grinding disc on the base, and a protective layer is coated on the diamond grinding disc under a pressure lower than a predetermined pressure, a predetermined temperature and a predetermined oscillation frequency.

[0010] According to another aspect of the present invention, a method for manufacturing a diamond dresser is provided, comprising providing a diamond grinding disc, providing a protective layer material, fixing the diamond grinding disc on a base in a working chamber, lowering the working chamber to a predetermined pressure, adjusting the diamond grinding disc to a predetermined temperature, oscillating the diamond grinding disc at a predetermined oscillation frequency, and coating a protective layer on the surface of the diamond grinding disc using the protective layer material.

[0011] In some embodiments, the predetermined temperature is between 20 and 60 degrees Celsius.

[0012] In some embodiments, the predetermined oscillation frequency is 30 to 500 Hz.

[0013] In some embodiments, the predetermined pressure is less than 0.05 standard atmosphere (atm).

[0014] In some embodiments, the protective layer is an acrylic protective layer, an epoxy resin protective layer, a polyurethane (PU) protective layer or a silicon-based protective layer.

[0015] Therefore, the manufacturing equipment and method of the diamond dresser of the present invention can provide a uniform protective layer for the diamond dresser and completely cover the surface of the diamond grinding disc to avoid metal contamination of the semiconductor process, while providing a stable grinding removal rate of the diamond dresser, reducing the variability in the semiconductor process, and eliminating microbubbles in the protective layer, while reducing pollution of the semiconductor process. Simple diagram description

[0016] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram of a manufacturing device for a diamond dresser according to an embodiment of the present invention. FIG. 2 is a schematic flow chart of a method for manufacturing a diamond dresser according to another embodiment of the present invention. Implementation

[0017] The following is a detailed description of the embodiments in conjunction with the attached drawings, but the provided embodiments are not intended to limit the scope of the present disclosure, and the description of the structural operation is not intended to limit the order of its execution. Any device with equal functions produced by the re-combination of components is within the scope of the present disclosure. In addition, the drawings are only for the purpose of explanation and are not drawn according to the original size. For ease of understanding, the same or similar components in the following description will be described with the same symbols.

[0018] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise specified. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art on the description of the present disclosure.

[0019] In the embodiments and patent claims, unless otherwise specified in the context, "a", "an" and "the" may refer to a single or multiple number. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation method.

[0020] Secondly, the words "include", "including", "have", "contain", etc. used in this article are all open terms, which means including but not limited to.

[0021] FIG. 1 is a schematic diagram of a manufacturing device for a diamond dresser according to an embodiment of the present invention. In addition, FIG. 2 is a flow diagram of a manufacturing method for a diamond dresser according to another embodiment of the present invention.

[0022] First, refer to FIG. 1. As shown in the figure, the manufacturing equipment 100 of the diamond dresser includes a working chamber 120 and a base 110. The base 110 is disposed in the working chamber 120, and the base 110 can control and adjust the temperature and vibration frequency of the diamond grinding disc 130 fixed thereon, and the working chamber 120 is a low-pressure working chamber or a vacuum working chamber, which does not deviate from the spirit and protection scope of the present invention.

[0023] In some embodiments, the base 110 includes an oscillator 112 and a heater 114, and the base 110 is used to fix the diamond grinding disc 130, and to coat the protective layer material on the surface of the diamond grinding disc 130 at a pressure lower than a predetermined pressure, at a predetermined temperature and at a predetermined oscillation frequency, so as to form a protective layer 140 on the diamond grinding disc 130.

[0024] In some embodiments, the predetermined temperature is 20 to 60 degrees Celsius.

[0025] In some embodiments, the predetermined oscillation frequency is 30 to 500 Hz.

[0026] In some embodiments, the predetermined pressure is less than 0.05 standard atmosphere (atm).

[0027] In some embodiments, the protective layer 140 is an acrylic protective layer, an epoxy resin protective layer, a polyurethane (PU) protective layer or a silicon-based protective layer.

[0028] In some embodiments, the diamond dresser 102 of the present invention further forms a protective layer 140 on a diamond grinding disc 130 to enhance the dressing performance of the diamond dresser 102. The diamond grinding disc 130 includes a substrate 132, a bonding layer 134, and a plurality of diamond particles 136. The diamond particles 136 are bonded to the substrate 132 using the bonding layer 134, and the bonding layer 134 can be fixed to the surface of the substrate 132 using electroplating or brazing. The protective layer 140 can effectively cover the surface of the substrate 132 and encapsulate the bonding layer 134 to prevent the metal of the substrate 132 and the bonding layer 134 from causing contamination of the semiconductor process.

[0029] According to another embodiment of the present invention, a method 200 for manufacturing a diamond dresser is disclosed, comprising the following steps. First, in step 210, a diamond grinding disc 130 is provided, and in step 220, a protective layer material is provided. In some embodiments, the protective layer material is an acrylic protective layer material, an epoxy resin protective layer material, a polyurethane (PU) protective layer or a silicon-based protective layer material, but the present invention is not limited thereto.

[0030] Next, in step 230, the diamond grinding disc 130 is fixed on a base 110 in a working chamber 120. Then, in step 240, the working chamber 120 is reduced to a predetermined pressure, for example, the predetermined pressure is less than 0.05 standard atmosphere (atm). Therefore, the working chamber 120 can be a low pressure chamber or a vacuum chamber, which does not deviate from the spirit and protection scope of the present invention.

[0031] Then, in step 250, the diamond grinding disc 130 is adjusted to a predetermined temperature, for example, the diamond grinding disc 130 is heated by the heater 114 of the base 110 and / or any other heating method, so as to control the surface temperature of the diamond grinding disc 130 to be about 20 to 60 degrees Celsius. In addition, referring to step 260, the diamond grinding disc 130 is oscillated at a predetermined oscillation frequency, wherein the predetermined oscillation frequency is 30 to 500 Hz, but the present invention is not limited thereto.

[0032] Step 270, using a protective layer material, coating a protective layer 140 on the surface of the diamond grinding disc 130.

[0033] The manufacturing method 200 of the diamond dresser of the present invention can adjust the pressure of the working chamber 120 by using the manufacturing equipment 100 of the diamond dresser when coating the protective layer 140, and adjust the temperature and vibration frequency of the diamond grinding disc 130 by using the base 110, so that the protective layer 140 formed by the protective layer material is more evenly formed on the surface of the diamond grinding disc 130, and completely covers the bonding layer 134 on the surface of the diamond grinding disc 130, effectively avoiding metal contamination of the semiconductor process, and at the same time, the uniform height of the protective layer 140 can partially expose the diamond particles 136 according to the needs, so as to provide the diamond dresser 102 with a more stable grinding removal rate (cutting rate), and the grinding removal rate of the diamond dresser 102 will not be affected by the uneven thickness of the protective layer 140. At the same time, due to the manufacturing equipment 100 and the manufacturing method 200 of the diamond dresser of the present case, microbubbles in the protective layer 140 can be eliminated, the protective function of the protective layer 140 is improved, and the unexpected risks of the semiconductor process are further reduced.

[0034] In addition, the diamond dresser manufacturing equipment 100 and the diamond dresser manufacturing method 200 of the present case can further reduce the contamination concerns of the diamond dresser 102 and the subsequent semiconductor process using the diamond dresser 102, and improve the quality and stability of the diamond dresser 102 and the semiconductor process.

[0035] In summary, the manufacturing equipment and method of the diamond dresser of the present invention can provide a uniform protective layer for the diamond dresser and completely cover the surface of the diamond grinding disc to avoid metal contamination in the semiconductor process, while providing a stable grinding removal rate of the diamond dresser, reducing the variability in the semiconductor process, and eliminating microbubbles in the protective layer, while reducing pollution in the semiconductor process.

[0036] Although the present disclosure has been disclosed as above in the form of implementation methods, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be based on the scope defined by the attached patent application.

[0037] 100: Manufacturing equipment for diamond dressers 102: Diamond Dresser 110: Base 112: Oscillator 114: Heater 120: working chamber 130: Diamond grinding disc 132:Substrate 134: Bonding layer 136: Diamond particles 140: Protective layer 200: Manufacturing method of diamond dresser 210~270: Steps

Claims

1. A manufacturing device for a diamond dresser, comprising: a working chamber; and a base disposed in the working chamber, wherein the base comprises an oscillator and a heater, and the base fixes a diamond grinding disc, and a protective layer is coated on the diamond grinding disc at a pressure lower than a predetermined pressure, a predetermined temperature and a predetermined oscillation frequency, wherein the predetermined oscillation frequency is 30 to 500 Hz.

2. The manufacturing apparatus of the diamond dresser as claimed in claim 1, wherein the predetermined temperature is 20 to 60 degrees Celsius.

3. The manufacturing apparatus of the diamond dresser as claimed in claim 2, wherein the predetermined pressure is less than 0.05 standard atmosphere (atm).

4. The manufacturing equipment of the diamond dresser as described in claim 1, wherein the protective layer is an acrylic protective layer, an epoxy resin protective layer, a polyurethane (PU) protective layer or a silicon-based protective layer.

5. A method for manufacturing a diamond dresser, comprising: providing a diamond grinding disc; providing a protective layer material; fixing the diamond grinding disc on a base in a working chamber; lowering the working chamber to a predetermined pressure; adjusting the diamond grinding disc to a predetermined temperature; oscillating the diamond grinding disc at a predetermined oscillation frequency; and using the protective layer material to apply a protective layer to the surface of the diamond grinding disc, wherein the predetermined oscillation frequency is 30 to 500 Hz.

6. The method for manufacturing a diamond dresser as claimed in claim 5, wherein the predetermined temperature is 20 to 60 degrees Celsius.

7. The method for manufacturing a diamond dresser according to claim 6, wherein the predetermined pressure is less than 0.05 standard atmosphere (atm).

8. The method for manufacturing a diamond dresser as described in claim 5, wherein the protective layer is an acrylic protective layer, an epoxy resin protective layer, a polyurethane (PU) protective layer or a silicon-based protective layer.

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