Stable polishing pad conditioner

Abstract

A stable polishing pad conditioner includes a substrate and a plurality of conditioning protrusions. A plurality of conditioning protrusions are fixed on the substrate, each of the condition protrusions includes a conditioning surface, a conditioning surface normal direction of the conditioning surface forms an angle with a vertical line of a conditioner base plane of the substrate, and the angle is less than

Description

Stable polishing pad conditioner The present invention relates to a polishing pad conditioner, and more particularly to a stable polishing pad conditioner. As the domestic and international semiconductor markets have flourished in recent years due to the demand for materials for computers and their peripheral products, the semiconductor industry has continued to expand and generated a large amount of foreign exchange income. The manufacturing process for semiconductor components is incredibly complex, involving technologies that encompass nearly all of the most important and pivotal technologies and inventions in modern human science. Therefore, semiconductor component production is not only a cutting-edge industry, but also one that requires enormous capital to sustain and sustain. Chemical mechanical polishing (CMP) is an essential technology in semiconductor manufacturing. To ensure a stable and continuous CMP process and maintain wafer quality, the polishing pad must be properly dressed with a dresser to restore its surface morphology and properties. Using a dresser to dress the polishing pad still has some problems. In particular, when the dresser is worn out, the cutting rate will change, thereby affecting the stability of the semiconductor process. How to effectively improve the stability of the grinding removal rate of the dresser will help improve the reliability, efficiency and production yield of semiconductor production. This summary is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This summary is not a complete overview of the present disclosure and is not intended to identify important / critical elements of the present invention or to define the scope of the present invention. One object of the present invention is to provide a stable polishing pad conditioner that can improve the quality and performance of the polishing pad conditioner, thereby improving the quality and stability of semiconductor production. To achieve the above objectives, one aspect of the present invention relates to a stable polishing pad conditioner comprising a substrate and a plurality of conditioning protrusions. The plurality of conditioning protrusions are secured to the substrate, each of the conditioning protrusions comprising a conditioning surface, wherein a normal to the conditioning surface forms an angle with a perpendicular to a base plane of the substrate, and the angle is less than 30 degrees. In some embodiments, the angle is less than 10 degrees. In some embodiments, the angle is less than 5 degrees. In some embodiments, the surface area of ​​the trimmed surface is between approximately 25 square microns and 10,000 square microns. In some embodiments, the surface area of ​​the trimmed surface is approximately 1600 square microns. In some embodiments, the angle between the lowest point of the trimming plane and the highest point of the trimming plane and the trimmer reference plane of the substrate is less than about 10 degrees. In some embodiments, the angle between the lowest point of the trimming plane and the highest point of the trimming plane and the trimmer reference plane of the substrate is less than about 5 degrees. In some embodiments, each trimming protrusion further includes a trimming protrusion side edge, and an angle formed between the trimming protrusion side edge and a perpendicular line to a trimmer reference plane of the substrate is approximately between 0 degrees and 60 degrees. In some embodiments, the trimming bumps include diamond bumps, diamond-like bumps, ceramic bumps, or silicon carbide bumps. In some embodiments, the trimming plane includes a triangular trimming plane, a square trimming plane, a quadrilateral trimming plane, a pentagonal trimming plane, a hexagonal trimming plane, a circular trimming plane, or an elliptical trimming plane. Therefore, the stable polishing pad dresser of the present invention can provide a more stable grinding removal rate, reduce the wear of the trimming protrusions, effectively reduce the variability in the semiconductor process, and thus increase the yield and output of semiconductor production. 100:Stable polishing pad dresser 101: Adjust the plane normal direction 110:Substrate 112: Dresser reference surface 120: Trimming protrusions 122: Trimming the surface 130: bonding layer 301: Trimming the plane normal direction 320: Trimming protrusions 322: Trimming the surface 401: Adjust the plane normal direction 420: Trimming protrusions 422: Trimming the surface 501: Adjust the plane normal direction 520: Trimming protrusions 522: Trimming the surface 601: Trimming the plane normal direction 602: Angle 603: Angle 604: Trim the lowest point of the plane 605: Trim the highest point of the plane 606: Horizontal Line 607: Vertical Line 608: Vertical Line 609: Angle 620: Trimming protrusions 622: Trimming the surface 626: Trimming the sides of the protrusions To make the above and other objects, features, advantages and embodiments of the present disclosure more apparent and understandable, the accompanying drawings are described as follows: FIG1 is a side view schematic diagram of a stable polishing pad dresser according to an embodiment of the present invention. FIG. 2 is a schematic perspective view of a stable polishing pad conditioner according to an embodiment of the present invention. FIG. 3 is a perspective schematic diagram of a stable polishing pad dresser according to another embodiment of the present invention. FIG. 4 is a perspective schematic diagram of a stable polishing pad dresser according to another embodiment of the present invention. FIG. 5 is a perspective view of a stable polishing pad conditioner according to yet another embodiment of the present invention. FIG. 6 is a schematic side view of a stable polishing pad conditioner according to any embodiment of the present invention. The following detailed description uses examples accompanied by accompanying drawings. However, these examples are not intended to limit the scope of this disclosure, and the description of the structural operation is not intended to limit the order of execution. Any recombination of components to produce a device with equivalent functionality is within the scope of this disclosure. Furthermore, the drawings are for illustrative purposes only and are not drawn to scale. To facilitate understanding, identical or similar components will be designated with the same reference numerals throughout the following description. In addition, the terms used throughout the specification and claims generally have their ordinary meanings in the art, in the context of this disclosure, and in the specific context, unless otherwise noted. Certain terms used to describe the present disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art regarding the description of the present disclosure. In the embodiments and claims, unless otherwise specified, the words "a," "an," and "the" may refer to a single or multiple number. The numbers used in the steps are only used to identify the steps for ease of description and are not intended to limit the order or implementation of the embodiments. Secondly, the words "include", "including", "have", "contain", etc. used in this article are open terms, which mean including but not limited to. FIG1 is a schematic side view of a stable polishing pad conditioner according to an embodiment of the present invention. FIG2 through FIG5 are perspective, partially enlarged schematic views illustrating various embodiments of the stable polishing pad conditioner. FIG6 is also a schematic, partially enlarged side view of a stable polishing pad conditioner. First, referring to FIG. 1 and FIG. 2 , as shown in the figures, a stable polishing pad conditioner 100 includes a substrate 110 and a plurality of dressing protrusions 120 fixed to the substrate 110 by a bonding layer 130. In addition, each dressing protrusion 120 includes a dressing surface 122 for contacting the surface of a chemical mechanical polishing pad to perform polishing pad conditioning. Conventional diamond dressers dress the polishing pad by aligning the tips of diamond particles with the polishing pad. However, during the dressing process, the diamond particles are consumed as they are used, resulting in a rapid change in the removal rate. Furthermore, the removal rate of conventional diamond dressers varies significantly between the initial and final stages of use. This, in turn, causes instability in semiconductor production, impacting the quality and efficiency of semiconductor production. The stable pad dresser 100 of the present invention utilizes a dressing surface 122 of the dressing protrusions 120 that is approximately parallel to the substrate 110 to extend the service life of the stable pad dresser 100 and provide a more stable removal rate. Therefore, the stable pad dresser 100 can further improve the quality and efficiency of semiconductor production. Referring further to FIG. 6 , as shown, a stable pad dresser has a dressing protrusion 620 fixed to a substrate 110. A dressing surface 622 on the dressing protrusion 620 has a dressing surface normal direction 601. The dressing surface normal direction 601 forms an angle 609 with a perpendicular line 608 to the dresser reference surface 112 of the substrate 110. This angle 609 is preferably less than 30 degrees. In some embodiments, the angle 609 is more preferably less than 10 degrees, for example, less than 5 degrees, to enhance the stable removal rate of the stable pad dresser. In some embodiments, the surface area of ​​the dressing surface 622 is preferably between about 25 square microns and 10,000 square microns, such as 1,600 square microns, to provide a stable polishing pad dresser with a required removal rate, and further stably provide a stable polishing pad dresser with a required removal rate. In some embodiments, the dressing plane 622 may include a lowest point 604 and a highest point 605 to define the angle of the dressing plane used to dress the polishing pad. As shown in the figure, the line connecting the lowest point 604 and the highest point 605 on the dressing plane 622 preferably forms an angle 603 with a horizontal line 606 parallel to the dresser reference surface 112 of the substrate 110 that is less than 30 degrees, more preferably less than 10 degrees, and even more preferably less than 5 degrees, without departing from the spirit and scope of the present invention. Furthermore, as shown, the lowest point 604 and the highest point 605 on the dressing plane 622 are located at opposite ends of the dressing plane 622, respectively. However, the present invention is not limited thereto, and the lowest point 604 and the highest point 605 may also be located elsewhere on the dressing plane 622. In some embodiments, to further provide a stable removal rate required for a stable polishing pad dresser, the dressing protrusion 620 includes at least one dressing protrusion side 626, and the angle 602 formed between the dressing protrusion side 626 and a perpendicular line 607 to the dresser reference surface 112 of the substrate 110 is preferably between approximately 0 degrees and 60 degrees. This prevents excessive changes in the removal rate after the dressing protrusion 620 is worn, thereby providing a stable removal rate. In some embodiments, the angle 602 formed between the dressing protrusion side 626 and the perpendicular line 607 to the dresser reference surface 112 of the substrate 110 is more preferably between approximately 0 degrees and 30 degrees to further provide a stable removal rate. In some embodiments, the trimming protrusions 620 may include diamond protrusions, diamond-like protrusions, ceramic protrusions, or silicon carbide protrusions. The trimming protrusions 620 may be formed by various methods such as deposition, shaping, etching, or machining to form the desired trimming protrusions 620. Referring to FIG. 2 , the triangular trimming protrusion 120 of the stable polishing pad dresser is fixed to the substrate 110 , and the trimming plane 122 of the trimming protrusion 120 preferably forms an angle 101 with the perpendicular line of the dresser reference surface 112 that is less than 30 degrees, more preferably less than 10 degrees, for example, less than 5 degrees, but the present invention is not limited thereto. Referring to FIG. 3 , the quadrilateral trimming protrusion 320 of the stable polishing pad dresser is fixed to the substrate 110 , and the trimming plane 322 of the trimming protrusion 320 has a trimming plane normal direction 301 that preferably forms an angle less than 30 degrees with the perpendicular line of the dresser reference surface 112 , more preferably less than 10 degrees, for example less than 5 degrees, but the present invention is not limited thereto. Similarly, referring to FIG. 4 , the trimming protrusion 420 of the stable polishing pad dresser can also be a pentagonal trimming protrusion fixed to the substrate 110, and the trimming plane normal direction 401 of the trimming plane 422 of the trimming protrusion 420 preferably forms an angle less than 30 degrees with the vertical line of the dresser reference surface 112, more preferably less than 10 degrees, for example less than 5 degrees, but the present invention is not limited to this. Further referring to FIG. 5 , the trimming protrusion 520 of the stable polishing pad dresser can also be a hexagonal trimming protrusion fixed to the substrate 110 , and the trimming plane normal direction 501 of the trimming plane 522 of the trimming protrusion 520 preferably forms an angle less than 30 degrees with the vertical line of the dresser reference surface 112 , more preferably less than 10 degrees, for example less than 5 degrees, but the present invention is not limited to this. In some embodiments, preferably, more than about 60% of the dressing protrusions on the stable polishing pad dresser have the aforementioned dressing flat surface, and more preferably, more than about 85% of the dressing protrusions have the aforementioned dressing flat surface. In some embodiments, all of the dressing protrusions on the stable polishing pad dresser are formed by the aforementioned dressing protrusions having the dressing flat surface. Therefore, the trimming surfaces on the trimming protrusions of the stable polishing pad conditioner of the present invention may be triangular trimming surfaces, square trimming surfaces, quadrilateral trimming surfaces, pentagonal trimming surfaces, or hexagonal trimming surfaces, but the present invention is not limited thereto. The trimming surfaces on the trimming protrusions of the stable polishing pad conditioner of the present invention may also be circular, elliptical, or other shapes, without departing from the spirit and scope of protection of the present invention. In addition, the surface area of ​​the triangular trimming surfaces, square trimming surfaces, quadrilateral trimming surfaces, pentagonal trimming surfaces, hexagonal trimming surfaces, circular trimming surfaces, or elliptical trimming surfaces on the stable polishing pad conditioner is between approximately 25 square microns and 10,000 square microns, for example, 1,600 square microns, but the present invention is not limited thereto. The angle formed by the side of the trimming protrusion and the vertical line of the dresser reference surface is preferably between 0 degrees and 60 degrees, for example, between 0 degrees and 30 degrees, to improve the stability of the grinding removal rate of the dresser, but the present invention is not limited thereto. In summary, the stable polishing pad dresser of the present invention can provide a more stable grinding removal rate, reduce the wear of the trimmed protrusions, effectively reduce the variability in the semiconductor process, and thus increase the yield and output of semiconductor production. Although the present disclosure has been disclosed above in the form of embodiments, this is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the scope of the appended patent applications. 100:Stable polishing pad dresser 101: Adjust the plane normal direction 110:Substrate 112: Dresser reference surface 120: Trimming protrusions 122: Trimming the surface 130: bonding layer

Claims

1. A stable polishing pad conditioner comprises: a substrate; and a plurality of conditioning protrusions fixed to the substrate, wherein each of the conditioning protrusions comprises a conditioning plane, and a normal direction of the conditioning plane forms an angle with a perpendicular line of a conditioning pad reference plane of the substrate, and the angle is less than 30 degrees, wherein the surface area of ​​the conditioning plane is approximately between 25 square microns and 10,000 square microns.

2. The stable polishing pad conditioner of claim 1, wherein the angle is less than 10 degrees.

3. The stable polishing pad conditioner of claim 1, wherein the angle is less than 5 degrees.

4. The stable polishing pad conditioner of claim 1, wherein the surface area of ​​the conditioning surface is approximately 1600 square microns.

5. The stable polishing pad dresser of claim 1, wherein the angle between a line connecting a lowest point of the dressing surface and a highest point of the dressing surface and the dresser reference plane of the substrate is less than about 10 degrees.

6. The stable polishing pad conditioner of claim 1, wherein the angle between a line connecting a lowest point of the dressing surface and a highest point of the dressing surface and the dresser reference plane of the substrate is less than about 5 degrees.

7. The stable polishing pad dresser as described in claim 1, wherein each of the dressing protrusions further includes a dressing protrusion side edge, and the angle formed by the dressing protrusion side edge and the vertical line of the dresser reference surface of the substrate is approximately between 0 degrees and 60 degrees.

8. The stable polishing pad dresser of claim 1, wherein the dressing protrusions comprise diamond protrusions, diamond-like protrusions, ceramic protrusions, or silicon carbide protrusions.

9. The stable polishing pad dresser of claim 1, wherein the dressing plane comprises a triangular dressing plane, a square dressing plane, a quadrilateral dressing plane, a pentagonal dressing plane, a hexagonal dressing plane, a circular dressing plane or an elliptical dressing plane.

Images