Adsorption device

TW202631360APending Publication Date: 2026-08-01NACHI FUJIKOSHI CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NACHI FUJIKOSHI CORP
Filing Date
2025-12-22
Publication Date
2026-08-01

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    Figure TWG2TA001071536_003
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Abstract

(Problem) The present invention provides an adsorption device that prevents burrs and gaps from being generated on the departure side of the end face when cutting a wafer from the end face of a silicon ingot. (Solution) The adsorption device (100) of the present invention is an adsorption device that adsorbs onto the end face (106) of a columnar silicon ingot (104), and includes a plurality of adsorption pads (114a to 114i) adsorbed onto the end face when cutting a wafer from the end face of the silicon ingot using a band saw (108), wherein the adsorption pads are arranged more on the departure side (F) relative to the entry side (E) of the cutting direction (A) of the band saw.
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