Resin molding apparatus and method for manufacturing resin molded articles

TW202631363APending Publication Date: 2026-08-01TOWA
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-06-27
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001071925_001
    Figure TWG2TA001071925_001
  • Figure TWG2TA001071925_002
    Figure TWG2TA001071925_002
  • Figure TWG2TA001071925_003
    Figure TWG2TA001071925_003
Patent Text Reader

Abstract

The present invention provides a resin molding device that can achieve the lifting and lowering of a movable platform with a simple structure. The resin molding apparatus includes: a main frame (20) having a bracket (25); a movable platform (31) supported by the main frame (20); a first ball screw (11) having a first gear (G1); a second ball screw (12) having a second gear (G2); a servo motor unit (15) having a drive member (18) connected to the first gear (G1) and the second gear (G2), which drives the first ball screw (11) and the second ball screw (12) to raise and lower the movable platform (31); a holding member (40) supported by the bracket (25) and holding the servo motor unit (15), which moves relative to the bracket (25) to change the positional relationship of the drive member (18) relative to the first gear (G1) and the second gear (G2); and a position adjustment mechanism (45A) for adjusting the relative position of the holding member (40) relative to the bracket (25).
Need to check novelty before this filing date? Find Prior Art