Layered structures, their manufacturing methods, devices, and particle dispersions

TW202631375APending Publication Date: 2026-08-01DEXERIALS CORP
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
DEXERIALS CORP
Filing Date
2025-12-12
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001071453_001
    Figure TWG2TA001071453_001
  • Figure TWG2TA001071453_002
    Figure TWG2TA001071453_002
  • Figure TWG2TA001071453_003
    Figure TWG2TA001071453_003
Patent Text Reader

Abstract

This invention provides a structure that combines high durability, conductivity, and quantum efficiency. The layered structure is characterized by comprising a substrate and a high-density particle layer on the substrate. The high-density particle layer contains nanoparticles with an inorganic film formed on their surface. The nanoparticles have a particle size of 1 nm or more and 50 nm or less. The filling rate of the nanoparticles per unit volume of the high-density particle layer is 30 vol% or more and 80 vol% or less. The thickness of the inorganic film is 0.1 nm or more and 5 nm or less. The energy level at the upper end of the valence band of the inorganic film is the same as or lower than the energy level at the upper end of the valence band of the nanoparticles, and the energy level at the lower end of the conduction band of the inorganic film is the same as or higher than the energy level at the lower end of the conduction band of the nanoparticles.
Need to check novelty before this filing date? Find Prior Art