Resin composition, cured material, laminate, method for manufacturing cured material, method for manufacturing laminate, method for manufacturing semiconductor device, semiconductor device, resin and compound

Abstract

The present invention provides a resin composition comprising a resin and a photopolymerization initiator, a cured product formed by curing the above composition and a method for manufacturing the same, a laminate comprising the cured product and a method for manufacturing the same, a semiconductor device and a method for manufacturing the same, and novel resins and compounds, wherein the aforementioned resin is at least one resin selected from the group consisting of polyimide and polyamine, and has a structure represented by the following formula (A-1).