Multilayer thin film

Abstract

This invention provides a laminated thin film that can improve operational efficiency during the manufacturing process of semiconductor devices. The laminated thin film 1 of this invention is characterized in that it is sequentially laminated with a first separator, a first adhesive layer, a substrate, a second adhesive layer, and a second separator; the first adhesive layer is composed of a low-adhesion adhesive layer, and the second adhesive layer is composed of a peelable adhesive layer; the 180° peel force F(1) of the first separator on the first adhesive layer, the 180° peel force F(2) of the second separator on the second adhesive layer, the 180° peel adhesion force P(2) of the second adhesive layer on the glass plate, and the 180° peel adhesion force P'(2) of the second adhesive layer on the glass plate after 5 minutes at 160°C (N / 50mm) satisfy the following relationship. F(2)≦F(1) P(2)≧F(1) P'(2) / P(2)<1.20 P'(2)<1.00

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