Substrate film for cutting discs

Abstract

A substrate film for dicing wafers is provided, which suppresses the generation of cutting debris during the dicing process of semiconductor wafers and has excellent anti-adhesion properties. The substrate film for dicing wafers is a laminated film having at least layers A, B, and C sequentially disposed, characterized in that: layer A has a ten-point average roughness Rz of 1.5 μm to 15.0 μm; layer B contains 85% to 99% by mass of an propylene copolymer and 1% to 15% by mass of an olefin-based thermoplastic elastomer; and layer C has an olefin-based thermoplastic elastomer.