Packaging laminate

TW202631400APending Publication Date: 2026-08-01C I TAKIRON CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
C I TAKIRON CORP
Filing Date
2025-09-03
Publication Date
2026-08-01

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Abstract

The present invention aims to provide a packaging laminate (1) comprising an extension film and a sealing film (2). The extension film has at least a substrate layer (3) with high-density polyethylene as the main component having a density of 0.950 g / cm3 or higher. The sealing film (2) is laminated on the extension film and is made of polyethylene as the main component. The heat shrinkage rate of the extension film in the extension direction after being heated at 120°C for 10 minutes is less than 5%. When the melting point of the substrate layer (3) is set as Mp1 [°C] and the melting point of the sealing film (2) is set as Mp2 [°C], the relationship Mp1 [°C] - Mp2 [°C] < 24.0 [°C] holds true. The object of the present invention is to provide a packaging laminate (1) comprising a stretched film having at least a base layer (3) primarily composed of high-density polyethylene having a density of 0.950 g / cm3 or more, and a sealant film (2) laminated on the stretched film and primarily composed of polyethylene, where the heat shrinkage rate of the stretched film in the stretching direction when heated at 120°C for 10 minutes is less than 5%, and the relationship Mp1 [°C] - Mp2 [°C] < 24.0 [°C] holds, where Mp1 [°C] is the melting point of the base layer (3) and Mp2 [°C] is the melting point of the sealant film (2).
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