Apparatus and method for processing wafer
TW202631476APending Publication Date: 2026-08-01TSMC CHINA COMPANY +1
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TSMC CHINA COMPANY
- Filing Date
- 2025-04-25
- Publication Date
- 2026-08-01
Smart Images
Figure TWG2TA001070085_001 
Figure TWG2TA001070085_002 
Figure TWG2TA001070085_003
Abstract
A method includes vertically moving a shelf in a chamber; using a distance sensor, measuring a vertical position of the shelf; determining whether a vertical position of a target stage of the shelf is within an acceptable range; and in response to the vertical position of the target stage is within an acceptable range, moving a wafer onto or away from the target stage.
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