Glass substrate for semiconductor packaging, and method for preparing same

Abstract

The present disclosure provides a glass substrate for semiconductor packaging, including a glass substrate including a first surface and a second surface facing each other, and an inner surface connecting the first surface and the second surface and defining a through-hole; and a metal layer disposed in the through-hole of the glass substrate, wherein the glass substrate includes a first region extending from the inner surface and having compressive stress, the through-hole has a first diameter at the first surface, has a second diameter at a point corresponding to

Images