Multilayer wiring board, manufacturing method of multilayer wiring board and multilayer wiring substrate

Abstract

The purpose of this invention is to provide a technology that prevents damage to the core substrate and ensures the reliability of the multilayer wiring board even in high humidity environments. The multilayer wiring board of this invention comprises: a core substrate, which is a glass substrate, having a first surface, a second surface facing the first surface, and a side surface connecting the peripheral portions of the first surface and the peripheral portions of the second surface; a first wiring layer formed on the first surface; and a second wiring layer formed on the second surface; the side surface is covered with a low water absorption resin with a water absorption rate of 0.05% to 0.6%.

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